PCB Testing
PCB Testing is crucial for preventing latent or field failures. ORS provides quick-turn PCB test services to help you meet your program needs reliably and quickly. Have questions? Our IPC Certified Inspection Specialists are on-site to assist with your needs!
IPC-A-600 Printed Circuit Board (PCB) Inspection consists of optical and/or microsection inspection. Externally observable conditions such as blistering, voiding and delamination are inspected optically. Internally observable conditions such as cracks, layer-to- layer spacing and PTH anomalies are inspected using microsectioning techniques.
IPC-TM-650 A/B and D Coupon Testing: Convection Reflow Simulation (Thermal Stress) and/or Thermal Shock testing of A/B or D coupons is performed using an OM thermal stress system. For D coupons, resistance data is captured every second per net. Testing meets the requirements of IPC-TM-650 2.6.27 and 2.6.7.2.
IPC-TM-650 Thermal Stress Testing of Plated-Through Holes is performed to determine whether plated-through holes can withstand the thermodynamic effects of the extreme heat to which they may be exposed during the assembly, rework, or repair process. This testing is performed in accordance with IPC-TM-650 2.6.8.
