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ORS Laboratories are ISO 9001:2015 and AS9100D Certified| 1 (855) ORS-LABS
Oneida Research Services, Inc.
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    • Package Gas Analysis (RGA Testing)
      • HR-IVA® (High Resolution IVA Testing)
      • IVA® (Internal Vapor Analysis)
      • Gas Sampling Cylinder Analysis
      • Organic Mass Spectrometry – GC/MS
      • Delta-P Getter Sorption Qualification Testing
    • Hermeticity Testing
      • HSHLD® (High Sensitivity Helium Leak Detection)
      • Krypton-85 Fine and Gross Leak Testing
      • Helium Fine Leak Hermeticity Testing
      • Gross Leak Hermeticity Testing Processes
      • Leak Site Identification
      • Implanted Medical Devices
    • Material Outgassing Analysis
      • Material Outgassing Studies
      • UHV-EGA (Ultra-High Vacuum Evolved Gas Analysis)
      • ASTM E595 Outgassing Testing
      • Thermal Gravimetric Analysis-Mass Spectrometry (TGA-MS)
      • RGA Outgassing and Cleanliness Qualification Testing
    • PCB Testing
      • IPC-A-600 Inspection
      • IPC-TM-650 A/B and D Coupon Testing
      • IPC-TM-650 Thermal Stress, Plated-Through Holes
      • SIR & ECM Testing
    • Component Analysis
      • Destructive Physical Analysis (DPA)
      • Construction Analysis
      • Failure Analysis (FA)
      • Ion Milling
      • Acoustic Microscopy
      • Real Time X-Ray
      • 3D CT X-Ray
      • Acid Decapsulation of Electronic Components
      • Micro FT-IR Spectroscopy
      • Scanning Electron Microscopy (SEM) Inspection
      • X-Ray Fluorescence Elemental Analysis
    • Environmental Testing
      • Accelerated Bias Aging
      • Autoclave Testing
      • Cyclic Moisture Resistance
      • Highly Accelerated Stress Test (HAST)
      • Moisture Sensitivity Level Testing (MSL)
      • Preconditioning Test
      • Salt Atmosphere Testing
      • Steam Aging
      • Temperature Cycling Testing
      • Temperature Humidity Testing
      • Temperature Storage Testing
      • Thermal Shock Testing
    • Mechanical Testing
      • Constant Acceleration Testing
      • Fiber Integrity Testing
      • Mechanical Shock Testing
      • Particle Impact Noise Detection (PIND)
      • Physical Dimension Testing
      • Random Vibration Testing
      • Resistance to Solvents Testing
      • Solder Heat Resistance Test (SHRT)
      • Solderability Testing
      • Transportation Testing
      • Variable Frequency Vibration Testing
    • Electrical Testing
      • Intermittent Operating Life (IOL)
      • Insulation Resistance (IR)
      • Dielectric Withstanding Voltage (DWV)
      • Semiconductor Parametric Testing
      • Capacitance and Dissipation Factor (C&DF)
      • Optoelectronic Testing
  • Instrument Sales & Service
    • IVA® Model 210s Internal Vapor Analyzer
    • HSHLD® Model 310 High Sensitivity Helium Leak Detection System
    • Delta-P Model 410 Getter Sorption Analyzer
    • UHV-EGA Model 510 Ultra-High Vacuum Evolved Gas Analyzer
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PCB Testing

PCB Testing is crucial for preventing latent or field failures. ORS provides quick-turn PCB test services to help you meet your program needs reliably and quickly. Have questions? Our IPC Certified Inspection Specialists are on-site to assist with your needs!

IPC-A-600 Printed Circuit Board (PCB) Inspection consists of optical and/or microsection inspection. Externally observable conditions such as blistering, voiding and delamination are inspected optically. Internally observable conditions such as cracks, layer-to- layer spacing and PTH anomalies are inspected using microsectioning techniques.

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IPC-TM-650 A/B and D Coupon Testing: Convection Reflow Simulation (Thermal Stress) and/or Thermal Shock testing of A/B or D coupons is performed using an OM thermal stress system. For D coupons, resistance data is captured every second per net. Testing meets the requirements of IPC-TM-650 2.6.27 and 2.6.7.2.

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IPC-TM-650 Thermal Stress Testing of Plated-Through Holes is performed to determine whether plated-through holes can withstand the thermodynamic effects of the extreme heat to which they may be exposed during the assembly, rework, or repair process. This testing is performed in accordance with IPC-TM-650 2.6.8.

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SIR & ECM Testing

Verify PCB cleanliness and prevent electrochemical failures. During PCB assembly, fluxes, solders, and other process chemicals can leave behind ionic residues that may lead to corrosion or electrochemical migration (ECM). Surface Insulation Resistance (SIR) and ECM testing provide objective data on process cleanliness and material compatibility. Using automated AutoSIR systems, ORS Labs measures electrical resistance across test coupons under controlled temperature, humidity, and bias voltage conditions. Low SIR readings or visible dendritic growth indicate potential contamination issues that can affect long-term reliability. Our testing follows IPC and J-STD standards, including IPC-TM-650 and J-STD-001, ensuring accurate, industry-compliant results.

Ensure your PCB assemblies meet reliability expectations before they reach the field.

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    • Mechanical Testing
      • Constant Acceleration Testing
      • Fiber Integrity Testing
      • Mechanical Shock Testing
      • Particle Impact Noise Detection (PIND)
      • Physical Dimension Testing
      • Random Vibration Testing
      • Resistance to Solvents Testing
      • Semiconductor Parametric Testing and Characterization
      • Solder Heat Resistance Test (SHRT)
      • Solderability Testing
      • Transportation Testing
      • Variable Frequency Vibration Testing
    • Organic Mass Spectrometry
    • Package Gas Analysis (RGA)
      • IVA® (Internal Vapor Analysis)
      • HR-IVA® (High Resolution IVA® Testing)
      • Delta-P Getter Sorption Qualification Testing
      • Gas Sampling Cylinder Analysis
    • Component Analysis
      • Micro FT-IR Spectroscopy
      • Scanning Electron Microscopy (SEM) Inspection
      • X-Ray Fluorescence Elemental Analysis
      • Destructive Physical Analysis (DPA)
        • Destructive Physical Analysis (DPA) Testing for Capacitors
        • Destructive Physical Analysis (DPA) Testing for Crystals
        • Destructive Physical Analysis (DPA) Testing for Diodes
        • Destructive Physical Analysis (DPA) Testing for Filters
        • Destructive Physical Analysis (DPA) Testing for Fuses
        • Destructive Physical Analysis (DPA) Testing for Hybrid Microcircuits
        • Destructive Physical Analysis (DPA) Testing for Microcircuits
        • Destructive Physical Analysis (DPA) Testing for PEMS
        • Destructive Physical Analysis (DPA) Testing for Relays
        • Destructive Physical Analysis (DPA) Testing for Resistors
        • Destructive Physical Analysis (DPA) Testing for Thermistors
        • Destructive Physical Analysis (DPA) Testing for Transistors
        • Destructive Physical Analysis (DPA) Testing of Magnetic Components
      • Construction Analysis
      • Failure Analysis (FA)
      • Acid Decapsulation of Electronic Components
      • Ion Milling
      • Acoustic Microscopy
      • Steam Aging / Solderability
    • Hermeticity Testing
      • HSHLD® (High Sensitivity Helium Leak Detection)
      • Krypton-85 Fine and Gross Leak Testing
      • Helium Fine Leak Hermeticity Testing
      • Gross Leak Hermeticity Testing Processes
      • Leak Site Identification
      • Implanted Medical Devices
    • Electrical Testing
    • Material Outgassing Analysis
      • ASTM E595 Outgassing Services
      • RGA Outgassing and Cleanliness Qualification Services
      • Thermal Gravimetric Analysis-Mass Spectrometry (TGA-MS)
      • Ultra-High Vacuum Evolved Gas Analysis
      • Material Outgassing Studies
    • PCB Testing
      • Printed Circuit Board Inspection Services
      • SIR & ECM Testing
      • IPC-TM-650 A/B and D Coupon Testing
      • IPC-TM-650 Thermal Stress Testing
    • Capacitance and Dissipation Factor (C&DF)
    • Dielectric Withstanding Voltage (DWV)
    • Insulation Resistance (IR)
    • Intermittent Operating Life (IOL)
    • Optoelectronic Testing
    • Destructive Physical Analysis (DPA) Testing for Connectors
    • Environmental Testing
      • Accelerated Bias Aging Test
      • Autoclave Testing
      • Cyclic Moisture Resistance
      • Highly Accelerated Stress Test (HAST)
      • Moisture Sensitivity Level Testing (MSL)
      • Salt Atmosphere Testing
      • SMD Preconditioning Test
      • Steam Aging
      • Temperature Cycling Testing
      • Temperature Humidity Testing
      • Temperature Storage Testing
      • Thermal Shock Testing
    • X-Ray Inspection
      • X-Ray Computed Tomography (CT)
    • Consulting Services

    Test Submission Forms

    Component Form - NY
    Component Form - CO
    Material Outgassing Form - NY
    Mech/Environmental Form - PA
    PCB Coupon Form - CO
    RGA/Hermeticity Form - NY
    RGA/Hermeticity Form - CO

    Testing Methods

    MIL-STD
    ASTM
    JEDEC
    IEC
    TELCORDIA
    ICP
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    Contact

    1 (855) ORS-LABS

    For general inquiries contact Krista Vivenzo

    kvivenzo@orslabs.com

    (315) 736-5480 ext. 2231

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    IVA®, HR-IVA® and HSHLD® are registered trademarks of Oneida Research Inc.
    Oneida Rad™ is a trademark of Oneida Research Services, Inc.

    New York

    Corporate Headquarters
    8282 Halsey Road
    Whitesboro, NY 13492 USA

    (315) 736-5480

    New York Office: DLA Suitability Letter

    Component Submission Form (NY)
    RGA/Hermeticity Submission Form (NY)
    Material Outgassing Submission Form (NY)

    Colorado

    8811 American Way, Suite 100
    Englewood, CO 80112 USA

    1 (855) ORS-LABS

    Colorado Office: DLA Suitability Letter

    Component Submission Form (CO)
    RGA/Hermeticity Submission Form (CO)
    PCB Coupon Submission Form (CO)

    France

    Oneida Recherche Services

    BP 163
    06903 SOPHIA ANTIPOLIS Cedex
    FRANCE

    +33 4 92 92 88 89

    European Office: DLA Suitability Letter

    Pennsylvania

    4201 Pottsville Pike
    Suite 420
    Reading, PA 19605 USA

    1 (855) ORS-LABS

    Pennsylvania Office: DLA Suitability Letter

    Mech/Enviro Submission Form (PA)

    Tools

    Howl-Mann Equation
    Oneida Rad™ Equation (Kr-85)
    Moisture Calculator
    Moisture Graph
    Gas Evolution in Leaking Package
    Solving for Oxygen Exchange Rate

    Certification

    ISO 9001:2015 & AS9100D Certified

    ISO/IEC 17025:2017 Accredited

    PJR Certification A2LA logo
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