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    • Package Gas Analysis (RGA Testing)
      • HR-IVA® (High Resolution IVA Testing)
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      • HSHLD® (High Sensitivity Helium Leak Detection)
      • Krypton-85 Fine and Gross Leak Testing
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      • Gross Leak Hermeticity Testing Processes
      • Leak Site Identification
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    • Material Outgassing Analysis
      • Material Outgassing Studies
      • UHV-EGA (Ultra-High Vacuum Evolved Gas Analysis)
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Material Outgassing Studies

Materials Outgassing & Characterization Studies

ORS has developed a method to characterize the outgassing of a large variety of samples.

The Raw Sample may have many forms like:

Typical IVA® study procedure:

  1. The sample is hermetically sealed in a clean and dry glass ampoule under controlled atmosphere (dry Nitrogen for example).
  2. A thermal stress is then applied and the sample outgasses in the hermetic enclosure (up to 1100°C).
  3. Finally, an IVA® test is performed on the ampoule.
  4. The test results give the complete gas picture (sealing atmosphere + outgassed substances).
  5. A complete range of organic and in-organic substances can be provided by performing both IVA® and  GC/MS testing.

Typical GC/MS headspace study procedure:

  1. The sample is hermetically sealed in a clean, dry headspace vial and sealed in room air with an appropriate septum.
  2. A thermal stress up to 300°C is then applied and the sample outgasses in the hermetic enclosure.
  3. The sample is pressurized with helium and a portion of the headspace is transferred to the GC inlet via the autosampler.
  4. The GC is temperature and pressure programmed to optimize detection of individual unknown organics.
  5. Combined with IVA® material outgassing, the test results give the complete gas picture (sealing atmosphere + outgassed substances) from low MW atmospheric gases through unknown volatile and semi-volatile organics.

Application Examples:

  • Hydrogen Outgassing from Package Kovar
  • Hydrogen is known to outgass from Kovar alloy when submitted to high temperatures.
  • This phenomenon is particularly critical in AsGa technology, for example, where hydrogen can lead to failures. Therefore, focus is put on lowering and controlling the hydrogen level.
  • The glass ampoule sealing can prove very valuable to characterize Hydrogen outgassing from metal packages. The various package elements (lid, walls, …) can be separated and outgassed individually. Various bake time and temperatures can be used to optimize pre-seal prebakes.

Note: It is possible to seal a sample several times. A possible application is to draw an outgassing curve as a function of time for a specific temperature.

Epoxy Outgassing

  • Epoxy materials have specific outgassing signatures which are easily identified and quantitated. This technique is useful to optimize pre-seal bakeout and to identify thermal stress by-products.
  • Moisture and CO2 are generally the main compounds outgassed from epoxy materials mainly because of under curing or over curing problems.
  • GC/MS analysis will detect organic constituent differences between properly and improperly cured or mixed samples, typically silicones.
Material Outgassing Submission Form (NY)
  • Mechanical Testing
    • Constant Acceleration Testing
    • Fiber Integrity Testing
    • Mechanical Shock Testing
    • Particle Impact Noise Detection (PIND)
    • Physical Dimension Testing
    • Random Vibration Testing
    • Resistance to Solvents Testing
    • Semiconductor Parametric Testing and Characterization
    • Solder Heat Resistance Test (SHRT)
    • Solderability Testing
    • Transportation Testing
    • Variable Frequency Vibration Testing
  • Organic Mass Spectrometry
  • Package Gas Analysis (RGA)
    • IVA® (Internal Vapor Analysis)
    • HR-IVA® (High Resolution IVA® Testing)
    • Delta-P Getter Sorption Qualification Testing
    • Gas Sampling Cylinder Analysis
  • Component Analysis
    • Micro FT-IR Spectroscopy
    • Scanning Electron Microscopy (SEM) Inspection
    • X-Ray Fluorescence Elemental Analysis
    • Destructive Physical Analysis (DPA)
      • Destructive Physical Analysis (DPA) Testing for Capacitors
      • Destructive Physical Analysis (DPA) Testing for Crystals
      • Destructive Physical Analysis (DPA) Testing for Diodes
      • Destructive Physical Analysis (DPA) Testing for Filters
      • Destructive Physical Analysis (DPA) Testing for Fuses
      • Destructive Physical Analysis (DPA) Testing for Hybrid Microcircuits
      • Destructive Physical Analysis (DPA) Testing for Microcircuits
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      • Destructive Physical Analysis (DPA) Testing for Relays
      • Destructive Physical Analysis (DPA) Testing for Resistors
      • Destructive Physical Analysis (DPA) Testing for Thermistors
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    • Construction Analysis
    • Failure Analysis (FA)
    • Acid Decapsulation of Electronic Components
    • Ion Milling
    • Acoustic Microscopy
    • Steam Aging / Solderability
  • Hermeticity Testing
    • HSHLD® (High Sensitivity Helium Leak Detection)
    • Krypton-85 Fine and Gross Leak Testing
    • Helium Fine Leak Hermeticity Testing
    • Gross Leak Hermeticity Testing Processes
    • Leak Site Identification
    • Implanted Medical Devices
  • Electrical Testing
  • Material Outgassing Analysis
    • ASTM E595 Outgassing Services
    • RGA Outgassing and Cleanliness Qualification Services
    • Thermal Gravimetric Analysis-Mass Spectrometry (TGA-MS)
    • Ultra-High Vacuum Evolved Gas Analysis
    • Material Outgassing Studies
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    • IPC-TM-650 A/B and D Coupon Testing
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  • Capacitance and Dissipation Factor (C&DF)
  • Dielectric Withstanding Voltage (DWV)
  • Insulation Resistance (IR)
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  • Optoelectronic Testing
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  • Environmental Testing
    • Accelerated Bias Aging Test
    • Autoclave Testing
    • Cyclic Moisture Resistance
    • Highly Accelerated Stress Test (HAST)
    • Moisture Sensitivity Level Testing (MSL)
    • Salt Atmosphere Testing
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    • Temperature Cycling Testing
    • Temperature Humidity Testing
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Test Submission Forms

Component Form - NY
Component Form - CO
Material Outgassing Form - NY
Mech/Environmental Form - PA
PCB Coupon Form - CO
RGA/Hermeticity Form - NY
RGA/Hermeticity Form - CO

Testing Methods

MIL-STD
ASTM
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IEC
TELCORDIA
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1 (855) ORS-LABS

For general inquiries contact Krista Vivenzo

kvivenzo@orslabs.com

(315) 736-5480 ext. 2231

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New York

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Whitesboro, NY 13492 USA

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New York Office: DLA Suitability Letter

Component Submission Form (NY)
RGA/Hermeticity Submission Form (NY)
Material Outgassing Submission Form (NY)

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Englewood, CO 80112 USA

1 (855) ORS-LABS

Colorado Office: DLA Suitability Letter

Component Submission Form (CO)
RGA/Hermeticity Submission Form (CO)
PCB Coupon Submission Form (CO)

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Oneida Recherche Services

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+33 4 92 92 88 89

European Office: DLA Suitability Letter

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Suite 420
Reading, PA 19605 USA

1 (855) ORS-LABS

Pennsylvania Office: DLA Suitability Letter

Mech/Enviro Submission Form (PA)

Tools

Howl-Mann Equation
Oneida Rad™ Equation (Kr-85)
Moisture Calculator
Moisture Graph
Gas Evolution in Leaking Package
Solving for Oxygen Exchange Rate

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