Destructive Physical Analysis (DPA)

  Testing Options

  • Mil-Std-883
  • Mil-Std-750
  • Mil-Std-1580
  • Ball Shear Strength
  • Bond Strength
  • DC I.V. Curve Tracing
  • Die Shear Strength
  • Digital Microscopy
  • External Visual Inspection
  • Fluorescence Microscopy
  • Glassivation Layer Integrity
  • High Resolution Film X-ray
  • Sub-Micron Real Time X-ray
  • Internal Visual Inspection
  • Cross-Sectioning
  • Particle Impact Noise Detection
  • Scanning Electron Microscopy (SEM) Inspection
  • SEM Metallization Inspection
  • Solder Reflow/Moisture Sensitivity Testing
  • Glassivation Thickness
  • Metallization Thickness
  • Hermeticity Testing
  • SEM, XRF, and FTIR Elemental Analysis
  • Scanning Acoustic Microscopy
    (C Mode)
  • Ion Milling
  • Laser De-encapsulation
  • Acid De-encapsulation
  • Sample De-lidding
  • Insulation Resistance
  • Dielectric Withstanding Voltage
  • Contact Retention
  • Plating Adhesion
  • Insulator Retention
MLCC Void found during DPA

Anomaly in MLCC observed during DPA performed by ORS

Destructive Physical Analysis, also known as DPA, is an inspection program utilized by the aerospace and terrestrial military industries intended to perform two main functions. One is to perform a final audit to verify the device’s construction design and meet material performance specifications and secondly, to screen for lot related process/manufacturing deficiencies thereby preventing inconsistent reliability. DPA testing supplements or exceeds a manufacturer’s lot screening process. Manufacturers may catch non-functioning components prior to shipment, but destructive physical analysis is designed to be more rigorous than a manufacturer’s lot screening process.

Parts ORS does DPA testing on:          

  • Capacitors
  • Connectors (see web page)
  • Crystals
  • Diodes
  • Filters
  • Fuses
  • Heaters
  • Magnetics (Transformer/Inductor)
  • Microcircuits
  • Plastic Encapsulated Microcircuits
  • Relays
  • Resistors
  • Thermistors
  • Transistors

DPA verifies and documents the quality of device construction through a complete tear-down disassembly of the device. By disassembling, testing, and inspecting a device, a complete profile can be created to determine how well a device conforms to design and process requirements. A complete DPA test flow typically consists of a systematic and progressive series of environmental and mechanical tests. In some cases, defects revealed in a device can result in rejection of an entire lot of devices.

ORS has over 30 years’ experience performing Destructive Physical Analysis and is well versed in DPA procedures. In addition to testing per Mil-Std-1580 and Mil-Std-883 method 5009, ORS is capable of performing client specified DPA test flows, either through a client’s selection of Mil-Std test procedures or a complete DPA performed to meet a client owned procurement document.

For More Information on our Frequently Used DPA Test Methods: