• Link to LinkedIn
ORS Laboratories are ISO 9001:2015 and AS9100D Certified| 1 (855) ORS-LABS
Oneida Research Services, Inc.
  • About Us
    • ORS Analytical Testing Services
    • 45 year anniversary
    • Career Opportunities
    • Locations
  • Services
    • Package Gas Analysis (RGA Testing)
      • HR-IVA® (High Resolution IVA Testing)
      • IVA® (Internal Vapor Analysis)
      • Gas Sampling Cylinder Analysis
      • Organic Mass Spectrometry – GC/MS
      • Delta-P Getter Sorption Qualification Testing
    • Hermeticity Testing
      • HSHLD® (High Sensitivity Helium Leak Detection)
      • Krypton-85 Fine and Gross Leak Testing
      • Helium Fine Leak Hermeticity Testing
      • Gross Leak Hermeticity Testing Processes
      • Leak Site Identification
      • Implanted Medical Devices
    • Material Outgassing Analysis
      • Material Outgassing Studies
      • UHV-EGA (Ultra-High Vacuum Evolved Gas Analysis)
      • ASTM E595 Outgassing Testing
      • Thermal Gravimetric Analysis-Mass Spectrometry (TGA-MS)
      • RGA Outgassing and Cleanliness Qualification Testing
    • PCB Testing
      • IPC-A-600 Inspection
      • IPC-TM-650 A/B and D Coupon Testing
      • IPC-TM-650 Thermal Stress, Plated-Through Holes
      • SIR & ECM Testing
    • Component Analysis
      • Destructive Physical Analysis (DPA)
      • Construction Analysis
      • Failure Analysis (FA)
      • Ion Milling
      • Acoustic Microscopy
      • Real Time X-Ray
      • 3D CT X-Ray
      • Acid Decapsulation of Electronic Components
      • Micro FT-IR Spectroscopy
      • Scanning Electron Microscopy (SEM) Inspection
      • X-Ray Fluorescence Elemental Analysis
    • Environmental Testing
      • Accelerated Bias Aging
      • Autoclave Testing
      • Cyclic Moisture Resistance
      • Highly Accelerated Stress Test (HAST)
      • Moisture Sensitivity Level Testing (MSL)
      • Preconditioning Test
      • Salt Atmosphere Testing
      • Steam Aging
      • Temperature Cycling Testing
      • Temperature Humidity Testing
      • Temperature Storage Testing
      • Thermal Shock Testing
    • Mechanical Testing
      • Constant Acceleration Testing
      • Fiber Integrity Testing
      • Mechanical Shock Testing
      • Particle Impact Noise Detection (PIND)
      • Physical Dimension Testing
      • Random Vibration Testing
      • Resistance to Solvents Testing
      • Solder Heat Resistance Test (SHRT)
      • Solderability Testing
      • Transportation Testing
      • Variable Frequency Vibration Testing
    • Electrical Testing
      • Intermittent Operating Life (IOL)
      • Insulation Resistance (IR)
      • Dielectric Withstanding Voltage (DWV)
      • Semiconductor Parametric Testing
      • Capacitance and Dissipation Factor (C&DF)
      • Optoelectronic Testing
  • Instrument Sales & Service
    • IVA® Model 210s Internal Vapor Analyzer
    • HSHLD® Model 310 High Sensitivity Helium Leak Detection System
    • Delta-P Model 410 Getter Sorption Analyzer
    • UHV-EGA Model 510 Ultra-High Vacuum Evolved Gas Analyzer
    • E595 Model 610 Outgassing Test System
    • CHLD 700H repair & upgrade
  • Resources
    • Blog
    • News
    • Publications
    • DLA Suitable Test Methods
    • Webinar
  • Tools
    • Moisture Calculator
    • Moisture Graph
    • Howl-Mann Equation
    • Oneida RAD™ Equation
    • Gas Evolution in Leaking Package
    • Solving for Oxygen Exchange Rate
  • Contact
  • Login
    • Customer Portal
    • ORS Cloud
  • Click to open the search input field Click to open the search input field Search
  • Menu Menu

Destructive Physical Analysis (DPA)

  Testing Options

  • Mil-Std-883
  • Mil-Std-750
  • Mil-Std-1580
  • Mil-Std-202
  • Ball Shear Strength
  • Bond Strength
  • DC I.V. Curve Tracing
  • Die Shear Strength
  • Digital Microscopy
  • External Visual Inspection
  • Fluorescence Microscopy
  • Glassivation Layer Integrity
  • High Resolution Film X-ray
  • Sub-Micron Real Time X-ray
  • Internal Visual Inspection
  • Cross-Sectioning
  • Particle Impact Noise Detection
  • Scanning Electron Microscopy (SEM) Inspection
  • SEM Metallization Inspection
  • Solder Reflow/Moisture Sensitivity Testing
  • Glassivation Thickness
  • Metallization Thickness
  • Hermeticity Testing
  • SEM, XRF, and FTIR Elemental Analysis
  • Scanning Acoustic Microscopy
    (C Mode)
  • Ion Milling
  • Laser De-encapsulation
  • Acid De-encapsulation
  • Sample De-lidding
  • Insulation Resistance
  • Dielectric Withstanding Voltage
  • Contact Retention
  • Plating Adhesion
  • Insulator Retention
MLCC Void found during DPA

Anomaly in MLCC observed during DPA performed by ORS

Destructive Physical Analysis, also known as DPA, is an inspection program utilized by the aerospace and terrestrial military industries intended to perform two main functions. One is to perform a final audit to verify the device’s construction design and meet material performance specifications and secondly, to screen for lot related process/manufacturing deficiencies thereby preventing inconsistent reliability. DPA testing supplements or exceeds a manufacturer’s lot screening process. Manufacturers may catch non-functioning components prior to shipment, but destructive physical analysis is designed to be more rigorous than a manufacturer’s lot screening process.

Parts ORS does DPA testing on:          

  • Capacitors 
  • Connectors
  • Crystals
  • Diodes 
  • Filters
  • Fuses
  • Hybrids
  • Magnetics (Transformer/Inductor)
  • Microcircuits
  • Plastic Encapsulated Microcircuits
  • Relays
  • Resistors
  • Thermistors
  • Transistors 

DPA testing verifies and documents the quality of device construction through a complete tear-down disassembly of the device. By disassembling, testing, and inspecting a device, a complete profile can be created to determine how well a device conforms to design and process requirements. A complete Destructive Physical Analysis or DPA test flow typically consists of a systematic and progressive series of environmental and mechanical tests. The applicable DPA tests are typically covered under military standards, often referred to as a Mil-Std. It is important to remember DPA is not a test itself, but rather a comprehensive series of tests where the parts are examined for design, workmanship and processing issues.

The objective of DPA military standards is to apply proven technical practices that will result in improved quality and reliable devices for end-use. They are intended to provide the general framework and basis for Destructive Physical Analysis procedures.

Although several military test standards are available, only a handful are used for DPA testing. The two most common DPA military standards are; Mil-Std-883 test method 5009 and Mil-Std-1580.

Mil-Std-883 test method 5009 – Destructive Physical Analysis. This DPA testing standard is generally used for microcircuit and hybrid or multichip components intended for high reliability space applications. The series of tests referenced in this standard refer MIL-STD-883 tests only. This test standard does not give requirements for Prohibited Material Analysis (PMA).

Mil-Std-1580 – Department of Defense Test Method Standard – Destructive Physical Analysis For Electronic, Electromagnetic, and Electromechanical Parts. This standard is used to ensure the high quality of parts used in the design of space and launch vehicles. Mil-Std-1580 DPA testing standard covers the detailed requirements for a wide variety of commodities as well as requirements for Prohibited Material Analysis (PMA) per Requirement 9. Since this test standard covers several different commodities, it refers to other military test standards to aid in the test program. Mil-Std-883, Mil-Std-750, Mil-Std-202 and Mil-Std-981 are referenced within Mil-Std-1580.

ORS has over 40 years’ experience performing Destructive Physical Analysis and is well versed in DPA testing procedures. In addition to testing per Mil-Std-1580 and Mil-Std-883 method 5009, ORS is capable of performing client specified DPA test flows, either through a client’s selection of Mil-Std test procedures or a complete DPA performed to meet a client owned procurement document.

View our DLA Suitability Letter

ORS maintains DLA suitability for most DPA test conditions per the Military Standard Test Methods

For More Information on our Frequently Used DPA Test Methods:
Mil-Std-750

DLA Suitable Bond Pull performed at ORS

ORS bond pull test
Mil-Std-883
Mil-Std-1580
Mil-Std-202

Request a Call

    Name

    Business Email

    Phone Number

    I am interested in:

    I would like:

    a phone conversation


      * all fields required

    • Mechanical Testing
      • Constant Acceleration Testing
      • Fiber Integrity Testing
      • Mechanical Shock Testing
      • Particle Impact Noise Detection (PIND)
      • Physical Dimension Testing
      • Random Vibration Testing
      • Resistance to Solvents Testing
      • Semiconductor Parametric Testing and Characterization
      • Solder Heat Resistance Test (SHRT)
      • Solderability Testing
      • Transportation Testing
      • Variable Frequency Vibration Testing
    • Organic Mass Spectrometry
    • Package Gas Analysis (RGA)
      • IVA® (Internal Vapor Analysis)
      • HR-IVA® (High Resolution IVA® Testing)
      • Delta-P Getter Sorption Qualification Testing
      • Gas Sampling Cylinder Analysis
    • Component Analysis
      • Micro FT-IR Spectroscopy
      • Scanning Electron Microscopy (SEM) Inspection
      • X-Ray Fluorescence Elemental Analysis
      • Destructive Physical Analysis (DPA)
        • Destructive Physical Analysis (DPA) Testing for Capacitors
        • Destructive Physical Analysis (DPA) Testing for Crystals
        • Destructive Physical Analysis (DPA) Testing for Diodes
        • Destructive Physical Analysis (DPA) Testing for Filters
        • Destructive Physical Analysis (DPA) Testing for Fuses
        • Destructive Physical Analysis (DPA) Testing for Hybrid Microcircuits
        • Destructive Physical Analysis (DPA) Testing for Microcircuits
        • Destructive Physical Analysis (DPA) Testing for PEMS
        • Destructive Physical Analysis (DPA) Testing for Relays
        • Destructive Physical Analysis (DPA) Testing for Resistors
        • Destructive Physical Analysis (DPA) Testing for Thermistors
        • Destructive Physical Analysis (DPA) Testing for Transistors
        • Destructive Physical Analysis (DPA) Testing of Magnetic Components
      • Construction Analysis
      • Failure Analysis (FA)
      • Acid Decapsulation of Electronic Components
      • Ion Milling
      • Acoustic Microscopy
      • Steam Aging / Solderability
    • Hermeticity Testing
      • HSHLD® (High Sensitivity Helium Leak Detection)
      • Krypton-85 Fine and Gross Leak Testing
      • Helium Fine Leak Hermeticity Testing
      • Gross Leak Hermeticity Testing Processes
      • Leak Site Identification
      • Implanted Medical Devices
    • Electrical Testing
    • Material Outgassing Analysis
      • ASTM E595 Outgassing Services
      • RGA Outgassing and Cleanliness Qualification Services
      • Thermal Gravimetric Analysis-Mass Spectrometry (TGA-MS)
      • Ultra-High Vacuum Evolved Gas Analysis
      • Material Outgassing Studies
    • PCB Testing
      • Printed Circuit Board Inspection Services
      • SIR & ECM Testing
      • IPC-TM-650 A/B and D Coupon Testing
      • IPC-TM-650 Thermal Stress Testing
    • Capacitance and Dissipation Factor (C&DF)
    • Dielectric Withstanding Voltage (DWV)
    • Insulation Resistance (IR)
    • Intermittent Operating Life (IOL)
    • Optoelectronic Testing
    • Destructive Physical Analysis (DPA) Testing for Connectors
    • Environmental Testing
      • Accelerated Bias Aging Test
      • Autoclave Testing
      • Cyclic Moisture Resistance
      • Highly Accelerated Stress Test (HAST)
      • Moisture Sensitivity Level Testing (MSL)
      • Salt Atmosphere Testing
      • SMD Preconditioning Test
      • Steam Aging
      • Temperature Cycling Testing
      • Temperature Humidity Testing
      • Temperature Storage Testing
      • Thermal Shock Testing
    • X-Ray Inspection
      • X-Ray Computed Tomography (CT)
    • Consulting Services

    Test Submission Forms

    Component Form - NY
    Component Form - CO
    Material Outgassing Form - NY
    Mech/Environmental Form - PA
    PCB Coupon Form - CO
    RGA/Hermeticity Form - NY
    RGA/Hermeticity Form - CO

    Testing Methods

    MIL-STD
    ASTM
    JEDEC
    IEC
    TELCORDIA
    ICP
    Search Search

    Contact

    1 (855) ORS-LABS

    For general inquiries contact Krista Vivenzo

    kvivenzo@orslabs.com

    (315) 736-5480 ext. 2231

    Policies

    Terms of Use

    ORS Terms & Conditions of Purchase Order

    ORS Terms & Conditions of Quotation and Sale

    IVA®, HR-IVA® and HSHLD® are registered trademarks of Oneida Research Inc.
    Oneida Rad™ is a trademark of Oneida Research Services, Inc.

    New York

    Corporate Headquarters
    8282 Halsey Road
    Whitesboro, NY 13492 USA

    (315) 736-5480

    New York Office: DLA Suitability Letter

    Component Submission Form (NY)
    RGA/Hermeticity Submission Form (NY)
    Material Outgassing Submission Form (NY)

    Colorado

    8811 American Way, Suite 100
    Englewood, CO 80112 USA

    1 (855) ORS-LABS

    Colorado Office: DLA Suitability Letter

    Component Submission Form (CO)
    RGA/Hermeticity Submission Form (CO)
    PCB Coupon Submission Form (CO)

    France

    Oneida Recherche Services

    BP 163
    06903 SOPHIA ANTIPOLIS Cedex
    FRANCE

    +33 4 92 92 88 89

    European Office: DLA Suitability Letter

    Pennsylvania

    4201 Pottsville Pike
    Suite 420
    Reading, PA 19605 USA

    1 (855) ORS-LABS

    Pennsylvania Office: DLA Suitability Letter

    Mech/Enviro Submission Form (PA)

    Tools

    Howl-Mann Equation
    Oneida Rad™ Equation (Kr-85)
    Moisture Calculator
    Moisture Graph
    Gas Evolution in Leaking Package
    Solving for Oxygen Exchange Rate

    Certification

    ISO 9001:2015 & AS9100D Certified

    ISO/IEC 17025:2017 Accredited

    PJR Certification A2LA logo
    © Copyright 2025 - Oneida Research Services, Inc. | Privacy Policy | Terms of Use
    Scroll to top Scroll to top Scroll to top