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ORS Laboratories are ISO 9001:2015 and AS9100D Certified| 1 (855) ORS-LABS
Oneida Research Services, Inc.
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    • Package Gas Analysis (RGA Testing)
      • HR-IVA® (High Resolution IVA Testing)
      • IVA® (Internal Vapor Analysis)
      • Gas Sampling Cylinder Analysis
      • Organic Mass Spectrometry – GC/MS
      • Delta-P Getter Sorption Qualification Testing
    • Hermeticity Testing
      • HSHLD® (High Sensitivity Helium Leak Detection)
      • Krypton-85 Fine and Gross Leak Testing
      • Helium Fine Leak Hermeticity Testing
      • Gross Leak Hermeticity Testing Processes
      • Leak Site Identification
      • Implanted Medical Devices
    • Material Outgassing Analysis
      • Material Outgassing Studies
      • UHV-EGA (Ultra-High Vacuum Evolved Gas Analysis)
      • ASTM E595 Outgassing Testing
      • Thermal Gravimetric Analysis-Mass Spectrometry (TGA-MS)
      • RGA Outgassing and Cleanliness Qualification Testing
    • PCB Testing
      • IPC-A-600 Inspection
      • IPC-TM-650 A/B and D Coupon Testing
      • IPC-TM-650 Thermal Stress, Plated-Through Holes
      • SIR & ECM Testing
    • Component Analysis
      • Destructive Physical Analysis (DPA)
      • Construction Analysis
      • Failure Analysis (FA)
      • Ion Milling
      • Acoustic Microscopy
      • Real Time X-Ray
      • 3D CT X-Ray
      • Acid Decapsulation of Electronic Components
      • Micro FT-IR Spectroscopy
      • Scanning Electron Microscopy (SEM) Inspection
      • X-Ray Fluorescence Elemental Analysis
    • Environmental Testing
      • Accelerated Bias Aging
      • Autoclave Testing
      • Cyclic Moisture Resistance
      • Highly Accelerated Stress Test (HAST)
      • Moisture Sensitivity Level Testing (MSL)
      • Preconditioning Test
      • Salt Atmosphere Testing
      • Steam Aging
      • Temperature Cycling Testing
      • Temperature Humidity Testing
      • Temperature Storage Testing
      • Thermal Shock Testing
    • Mechanical Testing
      • Constant Acceleration Testing
      • Fiber Integrity Testing
      • Mechanical Shock Testing
      • Particle Impact Noise Detection (PIND)
      • Physical Dimension Testing
      • Random Vibration Testing
      • Resistance to Solvents Testing
      • Solder Heat Resistance Test (SHRT)
      • Solderability Testing
      • Transportation Testing
      • Variable Frequency Vibration Testing
    • Electrical Testing
      • Intermittent Operating Life (IOL)
      • Insulation Resistance (IR)
      • Dielectric Withstanding Voltage (DWV)
      • Semiconductor Parametric Testing
      • Capacitance and Dissipation Factor (C&DF)
      • Optoelectronic Testing
  • Instrument Sales & Service
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X-Ray Inspection

X-ray inspection can be a very effective and non-destructive type of analysis. This form of interactive radiography provides internal viewing of an assembly’s design, internal components, workmanship and potential latent quality issues. Digital X-ray technology has added a new dimension to X-ray inspection that extends beyond traditional film-based cabinet type technology, including the use of specially devised algorithms for void analysis.

The term “digital” in digital X-ray refers to the technology of image acquisition where the data is collected or transferred to electronically stored media. Digital radiography detector technologies such as image intensifiers and solid-state panels can vary in size and pixel count. Digital radiography-based systems can offer the ability to view a sample while manipulating magnification, X-Y directions, rotation, tilt, and exposure. The advantage of digital X-ray over traditional film X-ray inspection is the improved imaging at magnification and the ease of image optimization.

Actively inspecting a device under manipulation is known as “real-time radiography”. Real-time X-ray systems can be equipped to mechanically rotate a device in steps, through a defined angular sequence, while collecting individual exposures. The exposures are assembled into a 3-dimensional model, where thin slices of the device can be generated and viewed, or stitched into 3D renderings, referred to as Computed Tomography or CT-Scans.

ORS Inc. has five digital X-ray systems from leading X-ray manufacturers such as COMET YXLON, SEAGATE, NORTHSTAR and DAGE, each with unique platforms and technology, allowing versatility to provide the best possible inspection of your devices. ORS employs image quality indicators (IQIs) manufactured and certified in accordance with ASTM E-801. Our systems have the capability to resolve a feature less than 0.001” and are optimal for screening devices to Mil-Prf-19500 (semiconductor devices), Mil-Prf-38535 (integrated circuits), or Mil-Prf-38534 (hybrid microcircuits). All ESD training is compliant with ANSI/ESD S20.20-2014 and Mil-Std-1686. Inspection and verification of ESD areas is performed quarterly with a field meter and multimeter traceable to NIST standards making ORS well equipped for screening of live and flight parts.

ORS has over 40 years of experience providing quality X-ray radiography services to the microelectronic, semiconductor, PCBA, and aerospace industries. ORS X-ray inspection is DLA suitable for Mil-Std 883/TM 2012, Mil-Std 750/TM 2076, and Mil-Std- 202/TM 209.

Standards & Specifications

  • MIL-STD-1580
  • MIL-STD-883, TM 2012*
  • MIL-STD-750, TM 2076*
  • MIL-STD-202, TM 209*
  • MIL-STD-981, APPENDIX B
  • MIL-DTL-3933
  • MSFC-STD-355
  • ESCC 20900
  • IDEA-STD-1010
  • MIL-PRF-27, APPENDIX B
  • ASTM E1161
  • ASTM E431

*ORS maintains DLA suitability for these test methods

Capabilities

  • Submicron spot size
  • 130KV to 225KV range
  • Automatic void identification and measurement software
  • Resolution less than 0.001” (1 mil)
  • Image analysis and measurement software
  • System (geometric) magnification up to 4800X (1400X)
  • Oblique angle viewing 0 to 45 degrees
  • Digital imaging
  • Laminography
  • Maximum inspection area of 18” x 16” (458mm x 407mm)
  • Maximum stage weight of 11 lbs. (5kg)

ORS will also work with clients to develop a specific Statement of Work (SOW) curated to the client’s analytical needs and ORS’ capabilities

Printed Circuit Board

  • Solder Joint Formation
  • Metallization Defects & Registrations
  • Via Alignment

Ceramic Packages

  • Frit Seals
  • Foreign Material
  • Die Attach

Metal Packages

  • Lid Seals
  • Die Attach
  • Opaque Particles

Plastic Packages

  • Die Placement
  • Die attach voiding
  • Bond Wire Sweep

Ball Grid Arrays

  • Solder Sphere Formation & Voiding
  • Die Attach

Failure Analysis

High voltage silicon carbide diode with severe EOS damage

Folds in the plated thru-hole barrel

Crack in capacitor

Non-functioning key FOB

Void Analysis

Contact area voiding in QFN

BGA void analysis

Lid seal voiding in microcircuit

Bellows solder joint void analysis

Electronic Part Types

Integrated circuit

Hybrid microcircuit

Attenuator

Transistor

Glass-bodied Diode

Thermistor

Crystal Oscillator

Inductor

Transformer

Amplifier

PEM

MCM

Multipin Connector

Relay

PED

Wire-wound resistor

Multi-anode tantalum chip capacitor

RF Connector

Other part types:

  • DC-DC Converter
  • Diodes (Thin key, Schottky, Wire-bonded, Zener voltage regulator)
  • EMI Filter
  • Isolator
  • Quartz Crystal
  • Bellows assemblies and sub-assemblies
  • Optocoupler
  • Filtered Connector
  • Power Divider
  • Resistor Network
  • Fuse
  • Switch
  • PCBs

Get more information about X-ray inspection.

Contact ORS
  • Mechanical Testing
    • Constant Acceleration Testing
    • Fiber Integrity Testing
    • Mechanical Shock Testing
    • Particle Impact Noise Detection (PIND)
    • Physical Dimension Testing
    • Random Vibration Testing
    • Resistance to Solvents Testing
    • Semiconductor Parametric Testing and Characterization
    • Solder Heat Resistance Test (SHRT)
    • Solderability Testing
    • Transportation Testing
    • Variable Frequency Vibration Testing
  • Organic Mass Spectrometry
  • Package Gas Analysis (RGA)
    • IVA® (Internal Vapor Analysis)
    • HR-IVA® (High Resolution IVA® Testing)
    • Delta-P Getter Sorption Qualification Testing
    • Gas Sampling Cylinder Analysis
  • Component Analysis
    • Micro FT-IR Spectroscopy
    • Scanning Electron Microscopy (SEM) Inspection
    • X-Ray Fluorescence Elemental Analysis
    • Destructive Physical Analysis (DPA)
      • Destructive Physical Analysis (DPA) Testing for Capacitors
      • Destructive Physical Analysis (DPA) Testing for Crystals
      • Destructive Physical Analysis (DPA) Testing for Diodes
      • Destructive Physical Analysis (DPA) Testing for Filters
      • Destructive Physical Analysis (DPA) Testing for Fuses
      • Destructive Physical Analysis (DPA) Testing for Hybrid Microcircuits
      • Destructive Physical Analysis (DPA) Testing for Microcircuits
      • Destructive Physical Analysis (DPA) Testing for PEMS
      • Destructive Physical Analysis (DPA) Testing for Relays
      • Destructive Physical Analysis (DPA) Testing for Resistors
      • Destructive Physical Analysis (DPA) Testing for Thermistors
      • Destructive Physical Analysis (DPA) Testing for Transistors
      • Destructive Physical Analysis (DPA) Testing of Magnetic Components
    • Construction Analysis
    • Failure Analysis (FA)
    • Acid Decapsulation of Electronic Components
    • Ion Milling
    • Acoustic Microscopy
    • Steam Aging / Solderability
  • Hermeticity Testing
    • HSHLD® (High Sensitivity Helium Leak Detection)
    • Krypton-85 Fine and Gross Leak Testing
    • Helium Fine Leak Hermeticity Testing
    • Gross Leak Hermeticity Testing Processes
    • Leak Site Identification
    • Implanted Medical Devices
  • Electrical Testing
  • Material Outgassing Analysis
    • ASTM E595 Outgassing Services
    • RGA Outgassing and Cleanliness Qualification Services
    • Thermal Gravimetric Analysis-Mass Spectrometry (TGA-MS)
    • Ultra-High Vacuum Evolved Gas Analysis
    • Material Outgassing Studies
  • PCB Testing
    • Printed Circuit Board Inspection Services
    • SIR & ECM Testing
    • IPC-TM-650 A/B and D Coupon Testing
    • IPC-TM-650 Thermal Stress Testing
  • Capacitance and Dissipation Factor (C&DF)
  • Dielectric Withstanding Voltage (DWV)
  • Insulation Resistance (IR)
  • Intermittent Operating Life (IOL)
  • Optoelectronic Testing
  • Destructive Physical Analysis (DPA) Testing for Connectors
  • Environmental Testing
    • Accelerated Bias Aging Test
    • Autoclave Testing
    • Cyclic Moisture Resistance
    • Highly Accelerated Stress Test (HAST)
    • Moisture Sensitivity Level Testing (MSL)
    • Salt Atmosphere Testing
    • SMD Preconditioning Test
    • Steam Aging
    • Temperature Cycling Testing
    • Temperature Humidity Testing
    • Temperature Storage Testing
    • Thermal Shock Testing
  • X-Ray Inspection
    • X-Ray Computed Tomography (CT)
  • Consulting Services

Test Submission Forms

Component Form - NY
Component Form - CO
Material Outgassing Form - NY
Mech/Environmental Form - PA
PCB Coupon Form - CO
RGA/Hermeticity Form - NY
RGA/Hermeticity Form - CO

Testing Methods

MIL-STD
ASTM
JEDEC
IEC
TELCORDIA
ICP
Search Search

Contact

1 (855) ORS-LABS

For general inquiries contact Krista Vivenzo

kvivenzo@orslabs.com

(315) 736-5480 ext. 2231

Policies

Terms of Use

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ORS Terms & Conditions of Quotation and Sale

IVA®, HR-IVA® and HSHLD® are registered trademarks of Oneida Research Inc.
Oneida Rad™ is a trademark of Oneida Research Services, Inc.

New York

Corporate Headquarters
8282 Halsey Road
Whitesboro, NY 13492 USA

(315) 736-5480

New York Office: DLA Suitability Letter

Component Submission Form (NY)
RGA/Hermeticity Submission Form (NY)
Material Outgassing Submission Form (NY)

Colorado

8811 American Way, Suite 100
Englewood, CO 80112 USA

1 (855) ORS-LABS

Colorado Office: DLA Suitability Letter

Component Submission Form (CO)
RGA/Hermeticity Submission Form (CO)
PCB Coupon Submission Form (CO)

France

Oneida Recherche Services

BP 163
06903 SOPHIA ANTIPOLIS Cedex
FRANCE

+33 4 92 92 88 89

European Office: DLA Suitability Letter

Pennsylvania

4201 Pottsville Pike
Suite 420
Reading, PA 19605 USA

1 (855) ORS-LABS

Pennsylvania Office: DLA Suitability Letter

Mech/Enviro Submission Form (PA)

Tools

Howl-Mann Equation
Oneida Rad™ Equation (Kr-85)
Moisture Calculator
Moisture Graph
Gas Evolution in Leaking Package
Solving for Oxygen Exchange Rate

Certification

ISO 9001:2015 & AS9100D Certified

ISO/IEC 17025:2017 Accredited

PJR Certification A2LA logo
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