Accelerated Bias Aging Test

Accelerated bias aging testing combines elevated temperature and voltage to accelerate various failure mechanisms in semiconductors. This process simulates years of real-life operation in just hours or days. Regression curves can be generated from the data to plot failures versus time and temperature. These curves are used to derive the device FIT (Failures-in-Time) rates. FIT rates are indicators of device reliability and are used to predict device performance at the use-condition, i.e. device operating temperature and voltage stress. One FIT implies one failure per 1e9 device-hours of operation.

Oneida Research Services has the ability to perform accelerated bias aging up to 200°C and up to 1700 Vdc. ORS also has AC input capability to age devices dynamically, thus more closely resembling actual use conditions. Our unique dedicated chambers have internal socketed DUT-boards and externally mounted, application-configurable interface cards with built-in capability for real-time per-device monitoring and a backup chart recorder to monitor chamber temperature and power supply voltage(s) as required. Additionally, we offer an option of monitoring and storing snapshot data at various intervals through the use of our data acquisition systems. This provides more detailed information about when a device fails and thus a better estimate of the FIT rate.