• Link to LinkedIn
ORS Laboratories are ISO 9001:2015 and AS9100D Certified| 1 (855) ORS-LABS
Oneida Research Services, Inc.
  • About Us
    • ORS Analytical Testing Services
    • 45 year anniversary
    • Career Opportunities
    • Locations
  • Services
    • Package Gas Analysis (RGA Testing)
      • HR-IVA® (High Resolution IVA Testing)
      • IVA® (Internal Vapor Analysis)
      • Gas Sampling Cylinder Analysis
      • Organic Mass Spectrometry – GC/MS
      • Delta-P Getter Sorption Qualification Testing
    • Hermeticity Testing
      • HSHLD® (High Sensitivity Helium Leak Detection)
      • Krypton-85 Fine and Gross Leak Testing
      • Helium Fine Leak Hermeticity Testing
      • Gross Leak Hermeticity Testing Processes
      • Leak Site Identification
      • Implanted Medical Devices
    • Material Outgassing Analysis
      • Material Outgassing Studies
      • UHV-EGA (Ultra-High Vacuum Evolved Gas Analysis)
      • ASTM E595 Outgassing Testing
      • Thermal Gravimetric Analysis-Mass Spectrometry (TGA-MS)
      • RGA Outgassing and Cleanliness Qualification Testing
    • PCB Testing
      • IPC-A-600 Inspection
      • IPC-TM-650 A/B and D Coupon Testing
      • IPC-TM-650 Thermal Stress, Plated-Through Holes
      • SIR & ECM Testing
    • Component Analysis
      • Destructive Physical Analysis (DPA)
      • Construction Analysis
      • Failure Analysis (FA)
      • Ion Milling
      • Acoustic Microscopy
      • Real Time X-Ray
      • 3D CT X-Ray
      • Acid Decapsulation of Electronic Components
      • Micro FT-IR Spectroscopy
      • Scanning Electron Microscopy (SEM) Inspection
      • X-Ray Fluorescence Elemental Analysis
    • Environmental Testing
      • Accelerated Bias Aging
      • Autoclave Testing
      • Cyclic Moisture Resistance
      • Highly Accelerated Stress Test (HAST)
      • Moisture Sensitivity Level Testing (MSL)
      • Preconditioning Test
      • Salt Atmosphere Testing
      • Steam Aging
      • Temperature Cycling Testing
      • Temperature Humidity Testing
      • Temperature Storage Testing
      • Thermal Shock Testing
    • Mechanical Testing
      • Constant Acceleration Testing
      • Fiber Integrity Testing
      • Mechanical Shock Testing
      • Particle Impact Noise Detection (PIND)
      • Physical Dimension Testing
      • Random Vibration Testing
      • Resistance to Solvents Testing
      • Solder Heat Resistance Test (SHRT)
      • Solderability Testing
      • Transportation Testing
      • Variable Frequency Vibration Testing
    • Electrical Testing
      • Intermittent Operating Life (IOL)
      • Insulation Resistance (IR)
      • Dielectric Withstanding Voltage (DWV)
      • Semiconductor Parametric Testing
      • Capacitance and Dissipation Factor (C&DF)
      • Optoelectronic Testing
  • Instrument Sales & Service
    • IVA® Model 210s Internal Vapor Analyzer
    • HSHLD® Model 310 High Sensitivity Helium Leak Detection System
    • Delta-P Model 410 Getter Sorption Analyzer
    • UHV-EGA Model 510 Ultra-High Vacuum Evolved Gas Analyzer
    • E595 Model 610 Outgassing Test System
    • CHLD 700H repair & upgrade
  • Resources
    • Blog
    • News
    • Publications
    • DLA Suitable Test Methods
    • Webinar
  • Tools
    • Moisture Calculator
    • Moisture Graph
    • Howl-Mann Equation
    • Oneida RAD™ Equation
    • Gas Evolution in Leaking Package
    • Solving for Oxygen Exchange Rate
  • Contact
  • Login
    • Customer Portal
    • ORS Cloud
  • Click to open the search input field Click to open the search input field Search
  • Menu Menu

Destructive Physical Analysis (DPA) Testing for Crystals

Microelectronic devices, assemblies and systems requiring stable clock signals utilize crystals as timing devices. The primary crystal blank material used for oscillators and resonators is quartz. Quartz is a piezoelectric material that resonates under an applied electric field. Crystal shape or geometry as well as orientation are varied to achieve a desired frequency value required for the application. The benefit of a crystal resonator relative to RLC circuits is the high Q-value, an essential property for many systems. Metal electrodes are deposited onto the crystal surface to orient the electrical field. The electrode/crystal metal is then used as attachment contacts for support pins that suspend the resonator within the package. The mass of the electrode metal influences the resonant frequency. Fine tuning of a crystal is achieved by laser trimming or deposition referred to as mass loading, depending on design. Due to the wide-ranging applications multiple package construction configurations exist.

Variations in environmental conditions, including vibrations, will influence the resonant frequency. Crystal packages are primarily hermetic to mitigate these environmental factures. Various construction designs that form hermetic packages would include metal and ceramic materials with glass bead-sealed pins and seam-welded or solder-sealed lids. Aerospace, military and automotive systems use hermetic packages that are subject to qualification requirements, including military performance specifications and DPA methods, to ensure performance and reliability. Crystal device construction variations require specific test methods in a DPA test flow. Crystals are tested to MIL-STD-1580 Requirement 12 for DPA and qualification requirements of MIL-STD-202 per MIL-PRF-3098.

Crystals included in microcircuits or oscillators impose additional testing requirements within the context of those assemblies.

Contact us for information about crystal testing

    * required field

    First Name *

    Last Name *

    Company *

    Business Email *

    Phone Number *

    How Can We Help

    I agree to the terms in the Privacy Policy. *

    TSON plastic encapsulated device

    Crystal SMD

    TO-247 plastic encapsulated microcircuit

    TO-8 Can

    SOT-23 plastic encapsulated microcircuit

    Ceramic Oscillator Package

    ORS Offers FAST Reliable Crystal DPA

    Destructive Physical Analysis

    ORS has over 40 years of experience performing comprehensive testing designed to identify anomalies that can lead to field failure. 

    ORS DPA techniques for crystals include: external inspection for package defects such as weld spatter, corrosion, dents, fractures and pin/lead alignment, hermeticity testing, radiographic examination for voiding and alignment, internal gas analysis (IGA) for vapor content, particle induced noise detection (PIND), internal visual inspection of package surfaces, crystal metal defects with configuration compliance and prohibited materials analysis.

    Non-Destructive Test Methods for Crystal Packages

    An important part of a Crystal DPA are the applicable initial non-destructive test methods – external visual inspection with physical dimensions/configuration compliance, X-ray radiography, hermeticity, particle-induced noise detection (PIND), prohibited material analysis (PMA) by X-ray fluorescence elemental analysis (XRF) or scanning electron microscopy with energy dispersive elemental analysis (SEM/EDS).

    Cross-sectional view of secondary copper bond with acceptable effective bond area

    External visual of ceramic

    X-ray Y-axis view of Crystal

    Z-axis view of Crystal alignment

    Optical side view

    X-ray view of crystal alignment

    Y-axis X-ray view

    Bottom view of Crystal oscillator package

    X-ray image of voiding Crystal attachment

    Z-axis view of crystal oscillator package

    Destructive Analysis Methods of Crystal Packages

    A complete Crystal DPA would include destructive test methods such as internal gas analysis (IGA) for internal vapor content and internal visual inspection (achieved by de-lidding per sample preparation instructions of MIL-STD-1580 Req 12 to facilitate optical inspection of internal packaging, crystal metal and electrode defects). Scanning electron microscopy with energy dispersive X-ray elemental analysis (SEM/EDS) may also be utilized for identification of internal prohibitive materials.

    Overall internal view

    SEM image of attachment

    Crystal metal edge

    Internal cavity view de-lidding by MIDAS

    Side view of support

    SEM of attachment

    Crystal in oscillator

    Mass loading deposition mis-alignment

    Bottom side of crystal

    Failure Modes of Crystals that Can Be Revealed by DPA:

    Failure modes of crystals will depend and vary on construction and by application

    • Loss of hermeticity
    • Voiding in crystal attachment  
    • Contamination/corrosion 
    • Crystal metal and electrode metal defects
    • Pure tin on external and internal surfaces
    • Undisclosed product changes

    Applicable Industries:

    • Space
    • Aerospace
    • Military Terrestrial
    • Automotive/Commercial
    • Mainframe Computers

    Military Standards:

    • MIL-PRF-3098
    • MIL-STD-1580/Req 13
    • MIL-STD-883 various Methods
    • MIL-STD-202 various Methods

    Crystal Test Methods

    MIL-STD-1580 Req 12 & 9
    MIL-PRF-3098
    MIL-STD-202 & MIL-STD-883
    • External Visual Optical inspection – 30X
    • Lead Finish MIL-STD-1580 REQ 9
    • X-ray Radiography MIL-STD-202, Method 209
    • PIND MIL-STD-883, Method 2020
    • Hermeticity Part Specification
    • Internal Water Vapor Testing MIL-STD-883, Method 1018
    • Internal Package Visual Optical inspection – 30X PMA – Req 9 Crystal inspection – 10X
    • SEM Metal Inspection Method 2077
    • Prohibited Materials Analysis Req. 9
    • Mechanical Testing
      • Constant Acceleration Testing
      • Fiber Integrity Testing
      • Mechanical Shock Testing
      • Particle Impact Noise Detection (PIND)
      • Physical Dimension Testing
      • Random Vibration Testing
      • Resistance to Solvents Testing
      • Semiconductor Parametric Testing and Characterization
      • Solder Heat Resistance Test (SHRT)
      • Solderability Testing
      • Transportation Testing
      • Variable Frequency Vibration Testing
    • Organic Mass Spectrometry
    • Package Gas Analysis (RGA)
      • IVA® (Internal Vapor Analysis)
      • HR-IVA® (High Resolution IVA® Testing)
      • Delta-P Getter Sorption Qualification Testing
      • Gas Sampling Cylinder Analysis
    • Component Analysis
      • Micro FT-IR Spectroscopy
      • Scanning Electron Microscopy (SEM) Inspection
      • X-Ray Fluorescence Elemental Analysis
      • Destructive Physical Analysis (DPA)
        • Destructive Physical Analysis (DPA) Testing for Capacitors
        • Destructive Physical Analysis (DPA) Testing for Crystals
        • Destructive Physical Analysis (DPA) Testing for Diodes
        • Destructive Physical Analysis (DPA) Testing for Filters
        • Destructive Physical Analysis (DPA) Testing for Fuses
        • Destructive Physical Analysis (DPA) Testing for Hybrid Microcircuits
        • Destructive Physical Analysis (DPA) Testing for Microcircuits
        • Destructive Physical Analysis (DPA) Testing for PEMS
        • Destructive Physical Analysis (DPA) Testing for Relays
        • Destructive Physical Analysis (DPA) Testing for Resistors
        • Destructive Physical Analysis (DPA) Testing for Thermistors
        • Destructive Physical Analysis (DPA) Testing for Transistors
        • Destructive Physical Analysis (DPA) Testing of Magnetic Components
      • Construction Analysis
      • Failure Analysis (FA)
      • Acid Decapsulation of Electronic Components
      • Ion Milling
      • Acoustic Microscopy
      • Steam Aging / Solderability
    • Hermeticity Testing
      • HSHLD® (High Sensitivity Helium Leak Detection)
      • Krypton-85 Fine and Gross Leak Testing
      • Helium Fine Leak Hermeticity Testing
      • Gross Leak Hermeticity Testing Processes
      • Leak Site Identification
      • Implanted Medical Devices
    • Electrical Testing
    • Material Outgassing Analysis
      • ASTM E595 Outgassing Services
      • RGA Outgassing and Cleanliness Qualification Services
      • Thermal Gravimetric Analysis-Mass Spectrometry (TGA-MS)
      • Ultra-High Vacuum Evolved Gas Analysis
      • Material Outgassing Studies
    • PCB Testing
      • Printed Circuit Board Inspection Services
      • SIR & ECM Testing
      • IPC-TM-650 A/B and D Coupon Testing
      • IPC-TM-650 Thermal Stress Testing
    • Capacitance and Dissipation Factor (C&DF)
    • Dielectric Withstanding Voltage (DWV)
    • Insulation Resistance (IR)
    • Intermittent Operating Life (IOL)
    • Optoelectronic Testing
    • Destructive Physical Analysis (DPA) Testing for Connectors
    • Environmental Testing
      • Accelerated Bias Aging Test
      • Autoclave Testing
      • Cyclic Moisture Resistance
      • Highly Accelerated Stress Test (HAST)
      • Moisture Sensitivity Level Testing (MSL)
      • Salt Atmosphere Testing
      • SMD Preconditioning Test
      • Steam Aging
      • Temperature Cycling Testing
      • Temperature Humidity Testing
      • Temperature Storage Testing
      • Thermal Shock Testing
    • X-Ray Inspection
      • X-Ray Computed Tomography (CT)
    • Consulting Services

    Test Submission Forms

    Component Form - NY
    Component Form - CO
    Material Outgassing Form - NY
    Mech/Environmental Form - PA
    PCB Coupon Form - CO
    RGA/Hermeticity Form - NY
    RGA/Hermeticity Form - CO

    Testing Methods

    MIL-STD
    ASTM
    JEDEC
    IEC
    TELCORDIA
    ICP
    Search Search

    Contact

    1 (855) ORS-LABS

    For general inquiries contact Krista Vivenzo

    kvivenzo@orslabs.com

    (315) 736-5480 ext. 2231

    Policies

    Terms of Use

    ORS Terms & Conditions of Purchase Order

    ORS Terms & Conditions of Quotation and Sale

    IVA®, HR-IVA® and HSHLD® are registered trademarks of Oneida Research Inc.
    Oneida Rad™ is a trademark of Oneida Research Services, Inc.

    New York

    Corporate Headquarters
    8282 Halsey Road
    Whitesboro, NY 13492 USA

    (315) 736-5480

    New York Office: DLA Suitability Letter

    Component Submission Form (NY)
    RGA/Hermeticity Submission Form (NY)
    Material Outgassing Submission Form (NY)

    Colorado

    8811 American Way, Suite 100
    Englewood, CO 80112 USA

    1 (855) ORS-LABS

    Colorado Office: DLA Suitability Letter

    Component Submission Form (CO)
    RGA/Hermeticity Submission Form (CO)
    PCB Coupon Submission Form (CO)

    France

    Oneida Recherche Services

    BP 163
    06903 SOPHIA ANTIPOLIS Cedex
    FRANCE

    +33 4 92 92 88 89

    European Office: DLA Suitability Letter

    Pennsylvania

    4201 Pottsville Pike
    Suite 420
    Reading, PA 19605 USA

    1 (855) ORS-LABS

    Pennsylvania Office: DLA Suitability Letter

    Mech/Enviro Submission Form (PA)

    Tools

    Howl-Mann Equation
    Oneida Rad™ Equation (Kr-85)
    Moisture Calculator
    Moisture Graph
    Gas Evolution in Leaking Package
    Solving for Oxygen Exchange Rate

    Certification

    ISO 9001:2015 & AS9100D Certified

    ISO/IEC 17025:2017 Accredited

    PJR Certification A2LA logo
    © Copyright 2025 - Oneida Research Services, Inc. | Privacy Policy | Terms of Use
    Scroll to top Scroll to top Scroll to top