Comparison of INO internal micro-Pirani measurement and ORS’ HR-IVA gas analysis total pressure measurement
Influence of ceramic package internal components on the performance of vacuum sealed uncooled bolometric detectors…
ORS Commercial Practice for IVA®
The purpose of this test method is to quantitatively measure the relative concentration of the internal vapor content, including water vapor, in gas filled hermetically sealed devices using a mass spectrometry technique….
Ensuring mission-critical component success with DPA testing
Destructive Physical Analysis (DPA) is essential used primarily for testing for the viability of mission-critical aerospace and military equipment. It’s a series of methods that involves thoroughly examining electronic components such as microcircuits and semiconductors to uncover construction deviations and workmanship anomalies. When lives are on the line or failure is not an option, DPA testing is an essential step that serves as final audit.
Preventing Moisture Failures in Sealed Electronic Devices
Moisture is a pervasive and existential threat to the performance of all microelectronic products. It can undermine the efficiency and dependability of mission-critical devices in your customers’ systems. In hermetically sealed microelectronic devices, the presence of any moisture, whether evolved from package materials or due to leakage – no matter how small – can cause component failure or malfunction.