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ORS Laboratories are ISO 9001:2015 and AS9100D Certified| 1 (855) ORS-LABS
Oneida Research Services, Inc.
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    • Package Gas Analysis (RGA Testing)
      • HR-IVA® (High Resolution IVA Testing)
      • IVA® (Internal Vapor Analysis)
      • Gas Sampling Cylinder Analysis
      • Organic Mass Spectrometry – GC/MS
      • Delta-P Getter Sorption Qualification Testing
    • Hermeticity Testing
      • HSHLD® (High Sensitivity Helium Leak Detection)
      • Krypton-85 Fine and Gross Leak Testing
      • Helium Fine Leak Hermeticity Testing
      • Gross Leak Hermeticity Testing Processes
      • Leak Site Identification
      • Implanted Medical Devices
    • Material Outgassing Analysis
      • Material Outgassing Studies
      • UHV-EGA (Ultra-High Vacuum Evolved Gas Analysis)
      • ASTM E595 Outgassing Testing
      • Thermal Gravimetric Analysis-Mass Spectrometry (TGA-MS)
      • RGA Outgassing and Cleanliness Qualification Testing
    • PCB Testing
      • IPC-A-600 Inspection
      • IPC-TM-650 A/B and D Coupon Testing
      • IPC-TM-650 Thermal Stress, Plated-Through Holes
      • SIR & ECM Testing
    • Component Analysis
      • Destructive Physical Analysis (DPA)
      • Construction Analysis
      • Failure Analysis (FA)
      • Ion Milling
      • Acoustic Microscopy
      • Real Time X-Ray
      • 3D CT X-Ray
      • Acid Decapsulation of Electronic Components
      • Micro FT-IR Spectroscopy
      • Scanning Electron Microscopy (SEM) Inspection
      • X-Ray Fluorescence Elemental Analysis
    • Environmental Testing
      • Accelerated Bias Aging
      • Autoclave Testing
      • Cyclic Moisture Resistance
      • Highly Accelerated Stress Test (HAST)
      • Moisture Sensitivity Level Testing (MSL)
      • Preconditioning Test
      • Salt Atmosphere Testing
      • Steam Aging
      • Temperature Cycling Testing
      • Temperature Humidity Testing
      • Temperature Storage Testing
      • Thermal Shock Testing
    • Mechanical Testing
      • Constant Acceleration Testing
      • Fiber Integrity Testing
      • Mechanical Shock Testing
      • Particle Impact Noise Detection (PIND)
      • Physical Dimension Testing
      • Random Vibration Testing
      • Resistance to Solvents Testing
      • Solder Heat Resistance Test (SHRT)
      • Solderability Testing
      • Transportation Testing
      • Variable Frequency Vibration Testing
    • Electrical Testing
      • Intermittent Operating Life (IOL)
      • Insulation Resistance (IR)
      • Dielectric Withstanding Voltage (DWV)
      • Semiconductor Parametric Testing
      • Capacitance and Dissipation Factor (C&DF)
      • Optoelectronic Testing
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Transportation Testing

Transportation testing practices have been established to provide a uniform basis upon which to evaluate the ability of shipping containers to withstand the rigors of the distribution supply chain. Transportation testing also determines how containers, packages or packaging components hold up to particular field conditions that they encounter during their life or testing cycle.

Transportation testing of devices entails designing containers that withstand complex stresses when subjected to vehicle transport. When designing a transportation test plan, tests such as vehicle stacking, vehicle vibration testing, random vibration testing, loose load testing and conditioning of containers or packaging components should be taken into consideration. During transportation testing, exposure to these stresses can affect the container, its interior packaging, means of closure and its contents.

boxes used for sample transportation

In order to transport devices properly, we help determine the most common packaging or product failures that result during supply chain activities, then replicate those failures in the laboratory. Once replicated, container transportation tests can also serve as a baseline necessary for the modification of future product success.

  • Test Specifications / Standards
  • ATSM D4169 Schedule D Stacked Vibration
  • ATSM D4169 Schedule E Vehicle Vibration
  • ATSM D4169 Schedule F Loose Load Vibration
  • ATSM D999 Method A1 Repetitive Shock (Vertical Motion)

Oneida Research Services offers the following device transportation testing developed by the American Society for Testing and Materials (ASTM) in the category of transportation stress testing:

  • Free fall drop test of loaded containers to ASTM-D5276
  • Vehicle stacking to ASTM-D4169
  • Vehicle vibration testing of shipping containers to ASTM-D999
  • Random vibration testing of shipping containers to ASTM-4728
  • Loose load testing to ASTM-D4169
  • Conditioning of containers or packaging components to ASTM-D4332
  • Conditioning of containers or packaging components to ASTM-D4169

Find out how to make sure containers can withstand the stresses of transportation.

Contact ORS
  • Mechanical Testing
    • Constant Acceleration Testing
    • Fiber Integrity Testing
    • Mechanical Shock Testing
    • Particle Impact Noise Detection (PIND)
    • Physical Dimension Testing
    • Random Vibration Testing
    • Resistance to Solvents Testing
    • Semiconductor Parametric Testing and Characterization
    • Solder Heat Resistance Test (SHRT)
    • Solderability Testing
    • Transportation Testing
    • Variable Frequency Vibration Testing
  • Organic Mass Spectrometry
  • Package Gas Analysis (RGA)
    • IVA® (Internal Vapor Analysis)
    • HR-IVA® (High Resolution IVA® Testing)
    • Delta-P Getter Sorption Qualification Testing
    • Gas Sampling Cylinder Analysis
  • Component Analysis
    • Micro FT-IR Spectroscopy
    • Scanning Electron Microscopy (SEM) Inspection
    • X-Ray Fluorescence Elemental Analysis
    • Destructive Physical Analysis (DPA)
      • Destructive Physical Analysis (DPA) Testing for Capacitors
      • Destructive Physical Analysis (DPA) Testing for Crystals
      • Destructive Physical Analysis (DPA) Testing for Diodes
      • Destructive Physical Analysis (DPA) Testing for Filters
      • Destructive Physical Analysis (DPA) Testing for Fuses
      • Destructive Physical Analysis (DPA) Testing for Hybrid Microcircuits
      • Destructive Physical Analysis (DPA) Testing for Microcircuits
      • Destructive Physical Analysis (DPA) Testing for PEMS
      • Destructive Physical Analysis (DPA) Testing for Relays
      • Destructive Physical Analysis (DPA) Testing for Resistors
      • Destructive Physical Analysis (DPA) Testing for Thermistors
      • Destructive Physical Analysis (DPA) Testing for Transistors
      • Destructive Physical Analysis (DPA) Testing of Magnetic Components
    • Construction Analysis
    • Failure Analysis (FA)
    • Acid Decapsulation of Electronic Components
    • Ion Milling
    • Acoustic Microscopy
    • Steam Aging / Solderability
  • Hermeticity Testing
    • HSHLD® (High Sensitivity Helium Leak Detection)
    • Krypton-85 Fine and Gross Leak Testing
    • Helium Fine Leak Hermeticity Testing
    • Gross Leak Hermeticity Testing Processes
    • Leak Site Identification
    • Implanted Medical Devices
  • Electrical Testing
  • Material Outgassing Analysis
    • ASTM E595 Outgassing Services
    • RGA Outgassing and Cleanliness Qualification Services
    • Thermal Gravimetric Analysis-Mass Spectrometry (TGA-MS)
    • Ultra-High Vacuum Evolved Gas Analysis
    • Material Outgassing Studies
  • PCB Testing
    • Printed Circuit Board Inspection Services
    • SIR & ECM Testing
    • IPC-TM-650 A/B and D Coupon Testing
    • IPC-TM-650 Thermal Stress Testing
  • Capacitance and Dissipation Factor (C&DF)
  • Dielectric Withstanding Voltage (DWV)
  • Insulation Resistance (IR)
  • Intermittent Operating Life (IOL)
  • Optoelectronic Testing
  • Destructive Physical Analysis (DPA) Testing for Connectors
  • Environmental Testing
    • Accelerated Bias Aging Test
    • Autoclave Testing
    • Cyclic Moisture Resistance
    • Highly Accelerated Stress Test (HAST)
    • Moisture Sensitivity Level Testing (MSL)
    • Salt Atmosphere Testing
    • SMD Preconditioning Test
    • Steam Aging
    • Temperature Cycling Testing
    • Temperature Humidity Testing
    • Temperature Storage Testing
    • Thermal Shock Testing
  • X-Ray Inspection
    • X-Ray Computed Tomography (CT)
  • Consulting Services

Test Submission Forms

Component Form - NY
Component Form - CO
Material Outgassing Form - NY
Mech/Environmental Form - PA
PCB Coupon Form - CO
RGA/Hermeticity Form - NY
RGA/Hermeticity Form - CO

Testing Methods

MIL-STD
ASTM
JEDEC
IEC
TELCORDIA
ICP
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Contact

1 (855) ORS-LABS

For general inquiries contact Krista Vivenzo

kvivenzo@orslabs.com

(315) 736-5480 ext. 2231

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IVA®, HR-IVA® and HSHLD® are registered trademarks of Oneida Research Inc.
Oneida Rad™ is a trademark of Oneida Research Services, Inc.

New York

Corporate Headquarters
8282 Halsey Road
Whitesboro, NY 13492 USA

(315) 736-5480

New York Office: DLA Suitability Letter

Component Submission Form (NY)
RGA/Hermeticity Submission Form (NY)
Material Outgassing Submission Form (NY)

Colorado

8811 American Way, Suite 100
Englewood, CO 80112 USA

1 (855) ORS-LABS

Colorado Office: DLA Suitability Letter

Component Submission Form (CO)
RGA/Hermeticity Submission Form (CO)
PCB Coupon Submission Form (CO)

France

Oneida Recherche Services

BP 163
06903 SOPHIA ANTIPOLIS Cedex
FRANCE

+33 4 92 92 88 89

European Office: DLA Suitability Letter

Pennsylvania

4201 Pottsville Pike
Suite 420
Reading, PA 19605 USA

1 (855) ORS-LABS

Pennsylvania Office: DLA Suitability Letter

Mech/Enviro Submission Form (PA)

Tools

Howl-Mann Equation
Oneida Rad™ Equation (Kr-85)
Moisture Calculator
Moisture Graph
Gas Evolution in Leaking Package
Solving for Oxygen Exchange Rate

Certification

ISO 9001:2015 & AS9100D Certified

ISO/IEC 17025:2017 Accredited

PJR Certification A2LA logo
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