Did you know…..?
ORS offers Reflow Soldering and Moisture Sensitivity (JEDEC J-STD-020C) analytical capabilities on devices intended for Surface Mount Technology applications.
Solder Reflow and Moisture Sensitivity Testing Services (JEDEC J-STD-020C) provide ORS clients the ability to subject components to a controlled introduction to moisture followed by board-level temperature cycling to evaluate the effects of Pb free processes. The calibrated seven-zone convection/conduction oven provides precise control over reflow processes and simulations ensuring that devices are not unduly exposed to thermal stress and that all packages can be successfully and reliably surface mounted. Sample preconditioning by on-site temperature and humidity chambers enables ORS to introduce moisture to non-hermetic packages. Following pre-conditioning, moisture sensitivity of the device can be evaluated by post-reflow reliability testing (ie. X-ray, C-SAM). Profiles used at ORS are based on JEDEC standards to ensure quality solder connections for all types of SMT packages.
The acquisition of this technique in addition to other analytical methods such as real-time x-ray, scanning acoustic microscopy and electrical testing establishes ORS as an equipped leader in the component analysis industry.
ORS has 3D Capability
X-Ray Computed Tomography (CT), commonly referred to as 3-D imaging, is a computer model generated from multiple 2-D X ray images. ORS currently has two CT systems with different design and capabilities to accommodate a broad range of samples sizes and configurations.