DLA Suitable List Approved for Test Military Devices (listed by location)
ORS New York office:
Mil-Std 883 Test Methods:
| TEST | METHOD | CONDITION |
|---|---|---|
| Seal | 1014 | A1, A2, A5, B1, B2, B1/B2 and B3 |
| External Visual | 2009 | N/A |
| Internal Visual (Monolithic) | 2010 | A, B |
| Radiography | 2012 | Non-Film (Digital) and Film |
| Physical Dimensions | 2016 | N/A |
| Internal Visual (Hybrid) | 2017 | H and K |
| SEM | 2018 | N/A |
| PIND | 2020 | A, B |
| Internal Gas Analysis | 1018 | N/A |
| Bond Strength | 2011 | D |
| Die Shear | 2019 | N/A |
| Internal Visual (Passive) | 2032 | H and K |
Mil-Std 750 Test Methods:
| TEST | METHOD | CONDITION |
|---|---|---|
| Internal Gas Analysis | 1018 | N/A |
| Seal | 1071 | A, B, G1, G2, H1, H2, H3 |
| Die Attach Integrity | 2017 | A |
| Bond Strength (Destructive Bond Pull) | 2037 | D |
| Physical Dimensions | 2066 | N/A |
| PRE–CAP visual, power MOSFET’S | 2069 | N/A |
| Visual and mechanical examination | 2071 | N/A |
| Internal Visual transistor (PRE–CAP) inspection | 2072 | N/A |
| Visual inspection for die (semiconductor diode) | 2073 | N/A |
| Decap Internal Visual Design Verification | 2075 | N/A |
| Radiography | 2076 | Non-Film (Digital) and Film |
| SEM | 2077 | N/A |
| PIND | 2052 | A, B |
| Destructive Physical Analysis for wire bonded devices | 2102 | N/A |
ORS Colorado office:
Mil-Std 883 Test Methods:
| TEST | METHOD | CONDITION |
|---|---|---|
| Seal | 1014 | A1, A2, A5, B1, B2, B1/B2 and B3 |
| Internal Gas Analysis | 1018 | N/A |
Mil-Std 750 Test Methods:
| TEST | METHOD | CONDITION |
|---|---|---|
| Seal | 1071 | A, B, G1, G2, H1, H2, and H3 |
| Internal Gas Analysis | 1018 | N/A |
ORS Pennsylvania office:
Mil-Std 883 Test Methods:
| TEST | METHOD | CONDITION |
|---|---|---|
| Moisture Resistance | 1004 | N/A |
| Stabilization Bake | 1008 | A,B,C,D |
| Salt Atmosphere | 1009 | A,B,C,D |
| Temperature Cycling | 1010 | A,B,C,D,F |
| Thermal Shock | 1011 | A,B,C |
| Constant Acceleration | 2001 | A,B,C,D,E,F |
| Mechanical Shock | 2002 | A,B |
| Solderability | 2003 | Test A,B |
| Vibration, Variable Frequency | 2007 | A |
| Resistance to Solvents | 2015 | N/A |
| Random Vibration | 2026 | I-II |
| Resistance to Soldering Heat | 2036 | A,B,I,J,K |
| Highly Accelerated Temperature and Humidity Stress Test (HAST) – Biased | JESD22-A110 | N/A |
| Accelerated Moisture Resistance – Unbiased HAST | JESD22-A118 | N/A |
ORS France office:
Mil-Std 883 Test Methods:
| TEST | METHOD | CONDITION |
|---|---|---|
| Internal Gas Analysis | 1018 | N/A |
Mil-Std 750 Test Methods:
| TEST | METHOD | CONDITION |
|---|---|---|
| Internal Gas Analysis | 1018 | N/A |
