DLA Suitable List Approved for Test Military Devices (listed by location)

ORS New York office:

Mil-Std 883 Test Methods:

TESTMETHODCONDITION
Seal1014A1, A2, A5, B1, B2, B1/B2 and B3
External Visual2009N/A
Internal Visual (Monolithic)2010A, B
Radiography2012Non-Film (Digital) and Film
Physical Dimensions2016N/A
Internal Visual (Hybrid)2017H and K
SEM2018N/A
PIND2020A, B
Internal Gas Analysis1018N/A
Bond Strength2011D
Die Shear2019N/A
Internal Visual (Passive)2032H and K

Mil-Std 750 Test Methods:

TESTMETHODCONDITION
Internal Gas Analysis1018N/A
Seal1071A, B, G1, G2, H1, H2, H3
Die Attach Integrity2017A
Bond Strength (Destructive Bond Pull)2037D
Physical Dimensions2066N/A
PRE–CAP visual, power MOSFET’S2069N/A
Visual and mechanical examination2071N/A
Internal Visual transistor (PRE–CAP) inspection2072N/A
Visual inspection for die (semiconductor diode)2073N/A
Decap Internal Visual Design Verification2075N/A
Radiography2076Non-Film (Digital) and Film
SEM2077N/A
PIND2052A, B
Destructive Physical Analysis for wire bonded devices2102N/A
Breakdown Voltage Collector to Emitter3011N/A
Collector to Base Cutoff Current3036N/A
Collector to Emitter Cutoff Current3041N/A
Emitter to Base Cutoff Current3061N/A
Base to Emitter Voltage3066N/A
Saturation Voltage and Resistance3071N/A
Forward Current Transfer Ratio3076N/A
Gate to Source Voltage or Current3403N/A
Breakdown Voltage, Drain to Source3407N/A
Gate Reverse Current3411N/A
Drain Current3413N/A
Static Drain to Source On State Resistance3421N/A
Forward Voltage4011N/A
Reverse Current Leakage4016N/A
Breakdown Voltage4022N/A

Mil-Std 202 Test Methods:

TESTMETHODCONDITION
Radiographic Inspection209N/A

ASTM E595 Test Methods:

TESTMETHODCONDITION
Standard Test Method for Total Mass Loss and Collected Volatile Condensable Materials from Outgassing in a Vacuum EnvironmentE595N/A

ORS Colorado office:

Mil-Std 883 Test Methods:

TESTMETHODCONDITION
Seal1014A1, A2, A5, B1, B2, B1/B2 and B3
Internal Gas Analysis1018N/A

Mil-Std 750 Test Methods:

TESTMETHODCONDITION
Seal1071A, B, G1, G2, H1, H2, and H3
Internal Gas Analysis1018N/A

IPC Test Methods:

TESTMETHODCONDITION
IPC-TM-650 – Thermal Stress (reflow)2.6.27A, B, G1, G2, H1, H2, and H3
IPC-TM-650 – Thermal Shock2.6.7.2N/A

ORS Pennsylvania office:

Mil-Std 883 Test Methods:

TESTMETHODCONDITION
Insulation Resistance1003A,B,C,D,E,F
Moisture Resistance1004N/A
Stabilization Bake1008A,B,C,D
Salt Atmosphere1009A,B,C,D
Temperature Cycling1010A,B,C,D,F
Thermal Shock1011A,B,C
Constant Acceleration2001A,B,C,D,E,F
Mechanical Shock2002A,B
Solderability2003 Test A,B
Lead Integrity2004A, A1, B1, B2, E
Vibration, Variable Frequency2007A
Resistance to Solvents2015N/A
Physical Dimensions2016N/A
Random Vibration2026 I-II
Resistance to Soldering Heat2036A,B,I,J,K
Highly Accelerated Temperature and
Humidity Stress Test (HAST) –
Biased		JESD22-A110N/A
Accelerated Moisture Resistance –
Unbiased HAST		JESD22-A118N/A

ORS France office:

Mil-Std 883 Test Methods:

TESTMETHODCONDITION
Seal1014A1, A2, and A5
Internal Gas Analysis1018N/A

Mil-Std 750 Test Methods:

TESTMETHODCONDITION
Internal Gas Analysis1018N/A
Seal1071H1, H2, and H3

To learn more about our DLA suitable test methods, please complete this form or call 1-855-ORS-LABS.

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