• Link to LinkedIn
ORS Laboratories are ISO 9001:2015 and AS9100D Certified| 1 (855) ORS-LABS
Oneida Research Services, Inc.
  • About Us
    • ORS Analytical Testing Services
    • 45 year anniversary
    • Career Opportunities
    • Locations
  • Services
    • Package Gas Analysis (RGA Testing)
      • HR-IVA® (High Resolution IVA Testing)
      • IVA® (Internal Vapor Analysis)
      • Gas Sampling Cylinder Analysis
      • Organic Mass Spectrometry – GC/MS
      • Delta-P Getter Sorption Qualification Testing
    • Hermeticity Testing
      • HSHLD® (High Sensitivity Helium Leak Detection)
      • Krypton-85 Fine and Gross Leak Testing
      • Helium Fine Leak Hermeticity Testing
      • Gross Leak Hermeticity Testing Processes
      • Leak Site Identification
      • Implanted Medical Devices
    • Material Outgassing Analysis
      • Material Outgassing Studies
      • UHV-EGA (Ultra-High Vacuum Evolved Gas Analysis)
      • ASTM E595 Outgassing Testing
      • Thermal Gravimetric Analysis-Mass Spectrometry (TGA-MS)
      • RGA Outgassing and Cleanliness Qualification Testing
    • PCB Testing
      • IPC-A-600 Inspection
      • IPC-TM-650 A/B and D Coupon Testing
      • IPC-TM-650 Thermal Stress, Plated-Through Holes
      • SIR & ECM Testing
    • Component Analysis
      • Destructive Physical Analysis (DPA)
      • Construction Analysis
      • Failure Analysis (FA)
      • Ion Milling
      • Acoustic Microscopy
      • Real Time X-Ray
      • 3D CT X-Ray
      • Acid Decapsulation of Electronic Components
      • Micro FT-IR Spectroscopy
      • Scanning Electron Microscopy (SEM) Inspection
      • X-Ray Fluorescence Elemental Analysis
    • Environmental Testing
      • Accelerated Bias Aging
      • Autoclave Testing
      • Cyclic Moisture Resistance
      • Highly Accelerated Stress Test (HAST)
      • Moisture Sensitivity Level Testing (MSL)
      • Preconditioning Test
      • Salt Atmosphere Testing
      • Steam Aging
      • Temperature Cycling Testing
      • Temperature Humidity Testing
      • Temperature Storage Testing
      • Thermal Shock Testing
    • Mechanical Testing
      • Constant Acceleration Testing
      • Fiber Integrity Testing
      • Mechanical Shock Testing
      • Particle Impact Noise Detection (PIND)
      • Physical Dimension Testing
      • Random Vibration Testing
      • Resistance to Solvents Testing
      • Solder Heat Resistance Test (SHRT)
      • Solderability Testing
      • Transportation Testing
      • Variable Frequency Vibration Testing
    • Electrical Testing
      • Intermittent Operating Life (IOL)
      • Insulation Resistance (IR)
      • Dielectric Withstanding Voltage (DWV)
      • Semiconductor Parametric Testing
      • Capacitance and Dissipation Factor (C&DF)
      • Optoelectronic Testing
  • Instrument Sales & Service
    • IVA® Model 210s Internal Vapor Analyzer
    • HSHLD® Model 310 High Sensitivity Helium Leak Detection System
    • Delta-P Model 410 Getter Sorption Analyzer
    • UHV-EGA Model 510 Ultra-High Vacuum Evolved Gas Analyzer
    • E595 Model 610 Outgassing Test System
    • CHLD 700H repair & upgrade
  • Resources
    • Blog
    • News
    • Publications
    • DLA Suitable Test Methods
    • Webinar
  • Tools
    • Moisture Calculator
    • Moisture Graph
    • Howl-Mann Equation
    • Oneida RAD™ Equation
    • Gas Evolution in Leaking Package
    • Solving for Oxygen Exchange Rate
  • Contact
  • Login
    • Customer Portal
    • ORS Cloud
  • Click to open the search input field Click to open the search input field Search
  • Menu Menu

Temperature Humidity Testing

Temperature humidity testing is useful in evaluating the performance of electronic, plastic and metal products in humid environments. High temperature and humidity are often the root cause of product failures because they accelerate corrosion, the wear of moving parts and the diffusion of moisture through moldings.

The high vapor pressure on the test samples constitutes the ‘force’ behind the moisture migration and penetration. The moisture penetration into packaging materials results in swelling, which in turn compromises their functional utility through increased wire-bond tension, wafer chip delamination and subtle changes in the properties of the packaging material.

Temperature Humidity

The temperature humidity test is also commonly referred to as ‘damp heat’ testing or ‘85/85′ testing (the most used condition). During these tests, samples are subjected to temperature-humidity stress for periods of 100, 500, 1,000 hours or more and humidity levels from 10 to 98%RH. For extended test durations, such as 1,000 hours, samples may be removed from the humidity test chamber for interim electrical testing and inspection at customer designated intervals. Oneida Research Services has the capability to perform humidity corrosion tests for all common temperature-humidity combinations.

Temperature humidity test standards include MIL-STD-202 Method 103B and GR-468-CORE.

Temperature and Humidity testing apparatus

Temperature Humidity Bias (THB)

Temperature humidity bias testing adds electrical bias to the stress to more readily detect electro-corrosion which can occur in the presence of ionic contamination. Applying electrical bias is designed to better simulate the conditions the device faces in its real-life applications. This process further accelerates the various failure modes, therefore predicting design failure in a reduced time frame. Humidity bias testing is normally limited to a maximum of 100 volts and low/negligible power dissipation since self-heating of the device from Joule heating will negate the effects of humidity on the intended process.

For the temperature humidity bias test, standards include, but are not limited to, MIL-STD-202 Method 103 and JESD22-A101. At ORS, we have the capability to conduct a wide range of temperature- humidity-voltage conditions while providing a source of current or voltage to the devices-under-test (DUT). Real-time per-device monitoring is also available during this test and this data can be recorded at any interval (minutes to hours) and provided to the customer at any desired time (hours or days). Because all test setups are custom designed, thermal runaway never occurs. This makes failure mode evaluation, if necessary, simpler and easier.

Oneida Research Services also offers H3TRB Temp Humid Reverse Bias testing (HTRB) and Cycled THB using the latest humidity testing equipment.

  • Test Specifications / Standards
  • MIL-STD-202 Method 103
  • MIL-STD-202 Method 103B
  • MIL-STD-750 Method 1021
  • JESD22-A101
  • GR-468-CORE

Get in touch for more information about Temperature Humidity Testing.

Contact ORS
  • Mechanical Testing
    • Constant Acceleration Testing
    • Fiber Integrity Testing
    • Mechanical Shock Testing
    • Particle Impact Noise Detection (PIND)
    • Physical Dimension Testing
    • Random Vibration Testing
    • Resistance to Solvents Testing
    • Semiconductor Parametric Testing and Characterization
    • Solder Heat Resistance Test (SHRT)
    • Solderability Testing
    • Transportation Testing
    • Variable Frequency Vibration Testing
  • Organic Mass Spectrometry
  • Package Gas Analysis (RGA)
    • IVA® (Internal Vapor Analysis)
    • HR-IVA® (High Resolution IVA® Testing)
    • Delta-P Getter Sorption Qualification Testing
    • Gas Sampling Cylinder Analysis
  • Component Analysis
    • Micro FT-IR Spectroscopy
    • Scanning Electron Microscopy (SEM) Inspection
    • X-Ray Fluorescence Elemental Analysis
    • Destructive Physical Analysis (DPA)
      • Destructive Physical Analysis (DPA) Testing for Capacitors
      • Destructive Physical Analysis (DPA) Testing for Crystals
      • Destructive Physical Analysis (DPA) Testing for Diodes
      • Destructive Physical Analysis (DPA) Testing for Filters
      • Destructive Physical Analysis (DPA) Testing for Fuses
      • Destructive Physical Analysis (DPA) Testing for Hybrid Microcircuits
      • Destructive Physical Analysis (DPA) Testing for Microcircuits
      • Destructive Physical Analysis (DPA) Testing for PEMS
      • Destructive Physical Analysis (DPA) Testing for Relays
      • Destructive Physical Analysis (DPA) Testing for Resistors
      • Destructive Physical Analysis (DPA) Testing for Thermistors
      • Destructive Physical Analysis (DPA) Testing for Transistors
      • Destructive Physical Analysis (DPA) Testing of Magnetic Components
    • Construction Analysis
    • Failure Analysis (FA)
    • Acid Decapsulation of Electronic Components
    • Ion Milling
    • Acoustic Microscopy
    • Steam Aging / Solderability
  • Hermeticity Testing
    • HSHLD® (High Sensitivity Helium Leak Detection)
    • Krypton-85 Fine and Gross Leak Testing
    • Helium Fine Leak Hermeticity Testing
    • Gross Leak Hermeticity Testing Processes
    • Leak Site Identification
    • Implanted Medical Devices
  • Electrical Testing
  • Material Outgassing Analysis
    • ASTM E595 Outgassing Services
    • RGA Outgassing and Cleanliness Qualification Services
    • Thermal Gravimetric Analysis-Mass Spectrometry (TGA-MS)
    • Ultra-High Vacuum Evolved Gas Analysis
    • Material Outgassing Studies
  • PCB Testing
    • Printed Circuit Board Inspection Services
    • SIR & ECM Testing
    • IPC-TM-650 A/B and D Coupon Testing
    • IPC-TM-650 Thermal Stress Testing
  • Capacitance and Dissipation Factor (C&DF)
  • Dielectric Withstanding Voltage (DWV)
  • Insulation Resistance (IR)
  • Intermittent Operating Life (IOL)
  • Optoelectronic Testing
  • Destructive Physical Analysis (DPA) Testing for Connectors
  • Environmental Testing
    • Accelerated Bias Aging Test
    • Autoclave Testing
    • Cyclic Moisture Resistance
    • Highly Accelerated Stress Test (HAST)
    • Moisture Sensitivity Level Testing (MSL)
    • Salt Atmosphere Testing
    • SMD Preconditioning Test
    • Steam Aging
    • Temperature Cycling Testing
    • Temperature Humidity Testing
    • Temperature Storage Testing
    • Thermal Shock Testing
  • X-Ray Inspection
    • X-Ray Computed Tomography (CT)
  • Consulting Services

Test Submission Forms

Component Form - NY
Component Form - CO
Material Outgassing Form - NY
Mech/Environmental Form - PA
PCB Coupon Form - CO
RGA/Hermeticity Form - NY
RGA/Hermeticity Form - CO

Testing Methods

MIL-STD
ASTM
JEDEC
IEC
TELCORDIA
ICP
Search Search

Contact

1 (855) ORS-LABS

For general inquiries contact Krista Vivenzo

kvivenzo@orslabs.com

(315) 736-5480 ext. 2231

Policies

Terms of Use

ORS Terms & Conditions of Purchase Order

ORS Terms & Conditions of Quotation and Sale

IVA®, HR-IVA® and HSHLD® are registered trademarks of Oneida Research Inc.
Oneida Rad™ is a trademark of Oneida Research Services, Inc.

New York

Corporate Headquarters
8282 Halsey Road
Whitesboro, NY 13492 USA

(315) 736-5480

New York Office: DLA Suitability Letter

Component Submission Form (NY)
RGA/Hermeticity Submission Form (NY)
Material Outgassing Submission Form (NY)

Colorado

8811 American Way, Suite 100
Englewood, CO 80112 USA

1 (855) ORS-LABS

Colorado Office: DLA Suitability Letter

Component Submission Form (CO)
RGA/Hermeticity Submission Form (CO)
PCB Coupon Submission Form (CO)

France

Oneida Recherche Services

BP 163
06903 SOPHIA ANTIPOLIS Cedex
FRANCE

+33 4 92 92 88 89

European Office: DLA Suitability Letter

Pennsylvania

4201 Pottsville Pike
Suite 420
Reading, PA 19605 USA

1 (855) ORS-LABS

Pennsylvania Office: DLA Suitability Letter

Mech/Enviro Submission Form (PA)

Tools

Howl-Mann Equation
Oneida Rad™ Equation (Kr-85)
Moisture Calculator
Moisture Graph
Gas Evolution in Leaking Package
Solving for Oxygen Exchange Rate

Certification

ISO 9001:2015 & AS9100D Certified

ISO/IEC 17025:2017 Accredited

PJR Certification A2LA logo
© Copyright 2025 - Oneida Research Services, Inc. | Privacy Policy | Terms of Use
Scroll to top Scroll to top Scroll to top