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Destructive Physical Analysis (DPA) Testing for Filters

Filters designed for electromagnetic interference, low pass and simple feed-through are subjected to DPA testing. Filters are designed with finishes, seals, capacitors and coils that suit their application. MIL-STD-1580 Requirement 14 addresses the testing requirements qualified to MIL-PRF-15733 and 28861 with typical configurations that include a metal body with glass-to-metal seals (hermetic), with and without internal potting resin.

Filters are characterized as passive devices comprised of a single solid pin extending through the center of an assembly with one or two co-axial disc ceramic capacitors to filter out high frequency signals to a chassis or a continuous conductor that is wound around discoidal ferrite core(s) and ceramic capacitors that restrict signal frequency(ies) that can pass through the device.

TSON plastic encapsulated device

EMI Filters Example 1

TO-247 plastic encapsulated microcircuit

EMI Filters Example 2

ORS Offers FAST Reliable Filter DPA

ORS performs Filter DPA in accordance with customer statements of work and MIL-STD-1580 Requirement 14 for Filters subjected to qualification requirements of MIL-PRF-15733, 28861, slash sheets and methods of MIL-STD-202.

Destructive Physical Analysis

ORS has over 40 years of experience performing comprehensive testing designed to identify anomalies that can lead to field failure. 

DPA testing of Filters includes non-destructive and destructive testing. Non-destructive testing consists of external visual examination, hermeticity testing, X-radiography and prohibited material inspection. Destructive testing includes a cross-sectional inspection of internal configuration and component integrity. 

Failure Modes That Can Be Revealed by DPA

Failure modes of Filters will depend on construction and by application.

Common causes for DPA filter failures include voiding in solder component attachment, cracked capacitor ceramic, and crack or chips in glass seals.

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    Non-Destructive Test Methods

    An important part of a Filter DPA are the applicable initial non-destructive test methods:

    • External visual inspection for variances, defects in seals with physical dimensions/configuration compliance per specification
    • X-ray Radiography for internal alignment, solder balls
    • Hermeticity (Seal) per MIL-STD-202-122
    • Prohibited material analysis (PMA) per MIL-STD-1580 Requirement 9
    Cross-sectional view of secondary copper bond with acceptable effective bond area

    Top glass seal

    X-ray view of Filter

    X-ray view of Filter

    Bottom glass seal

    Voiding capacitor attach

    Two capacitor filter

    Top glass seal

    Z-axis x-ray view of Filter

    Ceramic capacitor alignment

    Destructive Analysis Methods of Filter Testing

    A complete DPA of Filters includes destructive test methods.

    Internal visual inspection is achieved by cross-sectional analysis to multiple planes in the longitudinal and transverse axis directions. Inspection focuses include glass seals, solder and epoxy voids, cracks in capacitor and inductor cores, foreign material, misalignment, solder connections, wire stress relief, and insulation from core and housing.

    Initial longitudinal section

    Center longitudinal section

    Top discoidal capacitor

    Center longitudinal section

    Capacitor attach voiding

    Excessive voiding/flux

    Fractured capacitor

    Vicinal illumination

    High-temp solder attach

    Transverse section

    Capacitor attach voiding

    Excessive voiding

    Applicable Industries:

    • Space
    • Aerospace
    • Military Terrestrial
    • Automotive/Commercial
    • Mainframe Computers

    Military Standards:

    • MIL-PRF-15733, 28861
    • MIL-STD-1580/Req 14
    • MIL-STD-202 various Methods
    • EIA – 469

    Summary of Filter Testing Methods

    MIL-STD-1580 Requirement 14
    • External Visual 20X minimum
      • Header glass seals
      • Finish and plating verification
      • Terminal studs and mounting
    • Radiographic examination for internal construction – voids, fractures, foreign material
    • Hermeticity – MIL-PRF-6106
    • Internal Visual Examination 30X min.
      • Contamination, alignment
      • Voiding/fractures
      • Coil wire insulation
      • Glass Seals
    • Prohibited Materials Analysis Req. 9
    • Mechanical Testing
      • Constant Acceleration Testing
      • Fiber Integrity Testing
      • Mechanical Shock Testing
      • Particle Impact Noise Detection (PIND)
      • Physical Dimension Testing
      • Random Vibration Testing
      • Resistance to Solvents Testing
      • Semiconductor Parametric Testing and Characterization
      • Solder Heat Resistance Test (SHRT)
      • Solderability Testing
      • Transportation Testing
      • Variable Frequency Vibration Testing
    • Organic Mass Spectrometry
    • Package Gas Analysis (RGA)
      • IVA® (Internal Vapor Analysis)
      • HR-IVA® (High Resolution IVA® Testing)
      • Delta-P Getter Sorption Qualification Testing
      • Gas Sampling Cylinder Analysis
    • Component Analysis
      • Micro FT-IR Spectroscopy
      • Scanning Electron Microscopy (SEM) Inspection
      • X-Ray Fluorescence Elemental Analysis
      • Destructive Physical Analysis (DPA)
        • Destructive Physical Analysis (DPA) Testing for Capacitors
        • Destructive Physical Analysis (DPA) Testing for Crystals
        • Destructive Physical Analysis (DPA) Testing for Diodes
        • Destructive Physical Analysis (DPA) Testing for Filters
        • Destructive Physical Analysis (DPA) Testing for Fuses
        • Destructive Physical Analysis (DPA) Testing for Hybrid Microcircuits
        • Destructive Physical Analysis (DPA) Testing for Microcircuits
        • Destructive Physical Analysis (DPA) Testing for PEMS
        • Destructive Physical Analysis (DPA) Testing for Relays
        • Destructive Physical Analysis (DPA) Testing for Resistors
        • Destructive Physical Analysis (DPA) Testing for Thermistors
        • Destructive Physical Analysis (DPA) Testing for Transistors
        • Destructive Physical Analysis (DPA) Testing of Magnetic Components
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