Steam Aging / Solderability

Steam Aging has been designed to artificially age electronic components,  high density discrete components and circuit boards.  The time and temperature exposure  of the steam aging process may be used to replicate shelf life.  The steam aging process is often used in conjunction with solderability testing to determine if devices are able to meet the military and commercial Hi-Rel specifications of MIL-STD 202, Method 208.  The combination of aging and soliderability testing provides compliance with many  of the JEDEC and Military solderability test standards.

Standards Compliance in Steam Aging Includes:

  • Mil-STD-202 Method 208
  • IPC/EIA J-STD 002D

Standards Compliance in Solderability Testing Includes:

  • MIL-STD-202 Method 208
  • MIL-STD-883
  • IPC/EIA J-STD 002D