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Oneida Research Services, Inc.
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    • Package Gas Analysis (RGA Testing)
      • HR-IVA® (High Resolution IVA Testing)
      • IVA® (Internal Vapor Analysis)
      • Gas Sampling Cylinder Analysis
      • Organic Mass Spectrometry – GC/MS
      • Delta-P Getter Sorption Qualification Testing
    • Hermeticity Testing
      • HSHLD® (High Sensitivity Helium Leak Detection)
      • Krypton-85 Fine and Gross Leak Testing
      • Helium Fine Leak Hermeticity Testing
      • Gross Leak Hermeticity Testing Processes
      • Leak Site Identification
      • Implanted Medical Devices
    • Material Outgassing Analysis
      • Material Outgassing Studies
      • UHV-EGA (Ultra-High Vacuum Evolved Gas Analysis)
      • ASTM E595 Outgassing Testing
      • Thermal Gravimetric Analysis-Mass Spectrometry (TGA-MS)
      • RGA Outgassing and Cleanliness Qualification Testing
    • PCB Testing
      • IPC-A-600 Inspection
      • IPC-TM-650 A/B and D Coupon Testing
      • IPC-TM-650 Thermal Stress, Plated-Through Holes
      • SIR & ECM Testing
    • Component Analysis
      • Destructive Physical Analysis (DPA)
      • Construction Analysis
      • Failure Analysis (FA)
      • Ion Milling
      • Acoustic Microscopy
      • Real Time X-Ray
      • 3D CT X-Ray
      • Acid Decapsulation of Electronic Components
      • Micro FT-IR Spectroscopy
      • Scanning Electron Microscopy (SEM) Inspection
      • X-Ray Fluorescence Elemental Analysis
    • Environmental Testing
      • Accelerated Bias Aging
      • Autoclave Testing
      • Cyclic Moisture Resistance
      • Highly Accelerated Stress Test (HAST)
      • Moisture Sensitivity Level Testing (MSL)
      • Preconditioning Test
      • Salt Atmosphere Testing
      • Steam Aging
      • Temperature Cycling Testing
      • Temperature Humidity Testing
      • Temperature Storage Testing
      • Thermal Shock Testing
    • Mechanical Testing
      • Constant Acceleration Testing
      • Fiber Integrity Testing
      • Mechanical Shock Testing
      • Particle Impact Noise Detection (PIND)
      • Physical Dimension Testing
      • Random Vibration Testing
      • Resistance to Solvents Testing
      • Solder Heat Resistance Test (SHRT)
      • Solderability Testing
      • Transportation Testing
      • Variable Frequency Vibration Testing
    • Electrical Testing
      • Intermittent Operating Life (IOL)
      • Insulation Resistance (IR)
      • Dielectric Withstanding Voltage (DWV)
      • Semiconductor Parametric Testing
      • Capacitance and Dissipation Factor (C&DF)
      • Optoelectronic Testing
  • Instrument Sales & Service
    • IVA® Model 210s Internal Vapor Analyzer
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Temperature Cycle Testing

Temperature Cycling or Thermal Cycle testing is performed on materials to determine the resistance of exposure to alternating extremes of high and low temperatures. Thermal mismatch of materials can cause solder joint cracking, warpage, damage to leads and markings, and hermetic seal failures.

Powered Temperature Cycling (PTC) uses the same extreme temperature exposures as traditional temperature cycling but with the addition of simultaneous operating and electrical biases periodically applied and removed. PTC is used to simulate the worst case conditions in application environments.

Adhesives such as silicones, epoxies and polyurethanes can also be tested for thermal cycling resistance where the bonded materials may have different coefficients of thermal expansion and contraction. Conducting temperature cycling tests on these components will assist in determining:

  • The existence of thermal coefficient mismatches
  • The sensitivity of these mismatches to repeated temperature excursions

Oneida Research Services offers a range of temperature cycle test services to simulate different scenarios.

  • Temperature Cycle Test Specifications / Standards
  • GR-468-CORE
  • JESD22-A104
  • MIL-STD-750 Method 1051
  • MIL-STD-750 Method 1055
  • MIL-STD-883 Method 1010
  • Power Temperature Cycle Test Specifications / Standards
  • JESD22-A105
  • MIL-STD-883 Method 1007

Test conditions vary based on the type of sample being tested. Specific temperature cycling rates and other test conditions for components, boards, solder interconnects and/or tin whisker evaluations can be specified. The temperature cycle test is performed in chambers that control the number of cycles, dwell times, transfer times or ramp rates. Elevator-type chambers are used when ramp rates between the low and high temperature extremes must occur at a fairly rapid rate, like with MIL-STD-883 method 1010. If a slower ramp rate between temperature extremes is required, a single temperature cycle test chamber is best suited. By using a single-chamber piece of equipment, a specified, slower ramp (for example, 10°C per minute) can be set.

Graph of temp cycling results after one hour

Temperature cycle testing apparatus

Get in touch for more information about Temperature Cycle Testing.

Contact ORS
  • Mechanical Testing
    • Constant Acceleration Testing
    • Fiber Integrity Testing
    • Mechanical Shock Testing
    • Particle Impact Noise Detection (PIND)
    • Physical Dimension Testing
    • Random Vibration Testing
    • Resistance to Solvents Testing
    • Semiconductor Parametric Testing and Characterization
    • Solder Heat Resistance Test (SHRT)
    • Solderability Testing
    • Transportation Testing
    • Variable Frequency Vibration Testing
  • Organic Mass Spectrometry
  • Package Gas Analysis (RGA)
    • IVA® (Internal Vapor Analysis)
    • HR-IVA® (High Resolution IVA® Testing)
    • Delta-P Getter Sorption Qualification Testing
    • Gas Sampling Cylinder Analysis
  • Component Analysis
    • Micro FT-IR Spectroscopy
    • Scanning Electron Microscopy (SEM) Inspection
    • X-Ray Fluorescence Elemental Analysis
    • Destructive Physical Analysis (DPA)
      • Destructive Physical Analysis (DPA) Testing for Capacitors
      • Destructive Physical Analysis (DPA) Testing for Crystals
      • Destructive Physical Analysis (DPA) Testing for Diodes
      • Destructive Physical Analysis (DPA) Testing for Filters
      • Destructive Physical Analysis (DPA) Testing for Fuses
      • Destructive Physical Analysis (DPA) Testing for Hybrid Microcircuits
      • Destructive Physical Analysis (DPA) Testing for Microcircuits
      • Destructive Physical Analysis (DPA) Testing for PEMS
      • Destructive Physical Analysis (DPA) Testing for Relays
      • Destructive Physical Analysis (DPA) Testing for Resistors
      • Destructive Physical Analysis (DPA) Testing for Thermistors
      • Destructive Physical Analysis (DPA) Testing for Transistors
      • Destructive Physical Analysis (DPA) Testing of Magnetic Components
    • Construction Analysis
    • Failure Analysis (FA)
    • Acid Decapsulation of Electronic Components
    • Ion Milling
    • Acoustic Microscopy
    • Steam Aging / Solderability
  • Hermeticity Testing
    • HSHLD® (High Sensitivity Helium Leak Detection)
    • Krypton-85 Fine and Gross Leak Testing
    • Helium Fine Leak Hermeticity Testing
    • Gross Leak Hermeticity Testing Processes
    • Leak Site Identification
    • Implanted Medical Devices
  • Electrical Testing
  • Material Outgassing Analysis
    • ASTM E595 Outgassing Services
    • RGA Outgassing and Cleanliness Qualification Services
    • Thermal Gravimetric Analysis-Mass Spectrometry (TGA-MS)
    • Ultra-High Vacuum Evolved Gas Analysis
    • Material Outgassing Studies
  • PCB Testing
    • Printed Circuit Board Inspection Services
    • SIR & ECM Testing
    • IPC-TM-650 A/B and D Coupon Testing
    • IPC-TM-650 Thermal Stress Testing
  • Capacitance and Dissipation Factor (C&DF)
  • Dielectric Withstanding Voltage (DWV)
  • Insulation Resistance (IR)
  • Intermittent Operating Life (IOL)
  • Optoelectronic Testing
  • Destructive Physical Analysis (DPA) Testing for Connectors
  • Environmental Testing
    • Accelerated Bias Aging Test
    • Autoclave Testing
    • Cyclic Moisture Resistance
    • Highly Accelerated Stress Test (HAST)
    • Moisture Sensitivity Level Testing (MSL)
    • Salt Atmosphere Testing
    • SMD Preconditioning Test
    • Steam Aging
    • Temperature Cycling Testing
    • Temperature Humidity Testing
    • Temperature Storage Testing
    • Thermal Shock Testing
  • X-Ray Inspection
    • X-Ray Computed Tomography (CT)
  • Consulting Services

Test Submission Forms

Component Form - NY
Component Form - CO
Material Outgassing Form - NY
Mech/Environmental Form - PA
PCB Coupon Form - CO
RGA/Hermeticity Form - NY
RGA/Hermeticity Form - CO

Testing Methods

MIL-STD
ASTM
JEDEC
IEC
TELCORDIA
ICP
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Contact

1 (855) ORS-LABS

For general inquiries contact Krista Vivenzo

kvivenzo@orslabs.com

(315) 736-5480 ext. 2231

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IVA®, HR-IVA® and HSHLD® are registered trademarks of Oneida Research Inc.
Oneida Rad™ is a trademark of Oneida Research Services, Inc.

New York

Corporate Headquarters
8282 Halsey Road
Whitesboro, NY 13492 USA

(315) 736-5480

New York Office: DLA Suitability Letter

Component Submission Form (NY)
RGA/Hermeticity Submission Form (NY)
Material Outgassing Submission Form (NY)

Colorado

8811 American Way, Suite 100
Englewood, CO 80112 USA

1 (855) ORS-LABS

Colorado Office: DLA Suitability Letter

Component Submission Form (CO)
RGA/Hermeticity Submission Form (CO)
PCB Coupon Submission Form (CO)

France

Oneida Recherche Services

BP 163
06903 SOPHIA ANTIPOLIS Cedex
FRANCE

+33 4 92 92 88 89

European Office: DLA Suitability Letter

Pennsylvania

4201 Pottsville Pike
Suite 420
Reading, PA 19605 USA

1 (855) ORS-LABS

Pennsylvania Office: DLA Suitability Letter

Mech/Enviro Submission Form (PA)

Tools

Howl-Mann Equation
Oneida Rad™ Equation (Kr-85)
Moisture Calculator
Moisture Graph
Gas Evolution in Leaking Package
Solving for Oxygen Exchange Rate

Certification

ISO 9001:2015 & AS9100D Certified

ISO/IEC 17025:2017 Accredited

PJR Certification A2LA logo
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