DLA Suitable List Approved for Test Military Devices (listed by location)
ORS New York office:
Mil-Std 883 Test Methods:
TEST | METHOD | CONDITION |
---|---|---|
Seal | 1014 | A1, A2, A5, B1, B2, B1/B2 and B3 |
External Visual | 2009 | N/A |
Internal Visual (Monolithic) | 2010 | A, B |
Radiography | 2012 | Non-Film (Digital) and Film |
Physical Dimensions | 2016 | N/A |
Internal Visual (Hybrid) | 2017 | H and K |
SEM | 2018 | N/A |
PIND | 2020 | A, B |
Internal Gas Analysis | 1018 | N/A |
Bond Strength | 2011 | D |
Die Shear | 2019 | N/A |
Internal Visual (Passive) | 2032 | H and K |
Mil-Std 750 Test Methods:
TEST | METHOD | CONDITION |
---|---|---|
Internal Gas Analysis | 1018 | N/A |
Seal | 1071 | A, B, G1, G2, H1, H2, H3 |
Die Attach Integrity | 2017 | A |
Bond Strength (Destructive Bond Pull) | 2037 | D |
Physical Dimensions | 2066 | N/A |
PRE–CAP visual, power MOSFET’S | 2069 | N/A |
Visual and mechanical examination | 2071 | N/A |
Internal Visual transistor (PRE–CAP) inspection | 2072 | N/A |
Visual inspection for die (semiconductor diode) | 2073 | N/A |
Decap Internal Visual Design Verification | 2075 | N/A |
Radiography | 2076 | Non-Film (Digital) and Film |
SEM | 2077 | N/A |
PIND | 2052 | A, B |
Destructive Physical Analysis for wire bonded devices | 2102 | N/A |
Breakdown Voltage Collector to Emitter | 3011 | N/A |
Collector to Base Cutoff Current | 3036 | N/A |
Collector to Emitter Cutoff Current | 3041 | N/A |
Emitter to Base Cutoff Current | 3061 | N/A |
Base to Emitter Voltage | 3066 | N/A |
Saturation Voltage and Resistance | 3071 | N/A |
Forward Current Transfer Ratio | 3076 | N/A |
Gate to Source Voltage or Current | 3403 | N/A |
Breakdown Voltage, Drain to Source | 3407 | N/A |
Gate Reverse Current | 3411 | N/A |
Drain Current | 3413 | N/A |
Static Drain to Source On State Resistance | 3421 | N/A |
Forward Voltage | 4011 | N/A |
Reverse Current Leakage | 4016 | N/A |
Breakdown Voltage | 4022 | N/A |
Mil-Std 202 Test Methods:
TEST | METHOD | CONDITION |
---|---|---|
Radiographic Inspection | 209 | N/A |
ORS Colorado office:
Mil-Std 883 Test Methods:
TEST | METHOD | CONDITION |
---|---|---|
Seal | 1014 | A1, A2, A5, B1, B2, B1/B2 and B3 |
Internal Gas Analysis | 1018 | N/A |
Mil-Std 750 Test Methods:
TEST | METHOD | CONDITION |
---|---|---|
Seal | 1071 | A, B, G1, G2, H1, H2, and H3 |
Internal Gas Analysis | 1018 | N/A |
ORS Pennsylvania office:
Mil-Std 883 Test Methods:
TEST | METHOD | CONDITION |
---|---|---|
Moisture Resistance | 1004 | N/A |
Stabilization Bake | 1008 | A,B,C,D |
Salt Atmosphere | 1009 | A,B,C,D |
Temperature Cycling | 1010 | A,B,C,D,F |
Thermal Shock | 1011 | A,B,C |
Constant Acceleration | 2001 | A,B,C,D,E,F |
Mechanical Shock | 2002 | A,B |
Solderability | 2003 | Test A,B |
Vibration, Variable Frequency | 2007 | A |
Resistance to Solvents | 2015 | N/A |
Random Vibration | 2026 | I-II |
Resistance to Soldering Heat | 2036 | A,B,I,J,K |
Highly Accelerated Temperature and Humidity Stress Test (HAST) – Biased | JESD22-A110 | N/A |
Accelerated Moisture Resistance – Unbiased HAST | JESD22-A118 | N/A |
ORS France office:
Mil-Std 883 Test Methods:
TEST | METHOD | CONDITION |
---|---|---|
Seal | 1014 | A1, A2, and A5 |
Internal Gas Analysis | 1018 | N/A |
Mil-Std 750 Test Methods:
TEST | METHOD | CONDITION |
---|---|---|
Internal Gas Analysis | 1018 | N/A |
Seal | 1071 | H1, H2, and H3 |